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Wafer cutting fluid containing natural plant extracts

A technology of natural plants and extracts, used in lubricating compositions, petroleum industry, etc., can solve the problems of residue/particle accumulation, static electricity accumulation, metal corrosion, etc., and achieve the effect of inhibiting electrochemical corrosion and improving electron density

Inactive Publication Date: 2021-04-16
江苏奥首材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

To make matters worse, water coolant can cause static buildup, causing residue / particle buildup in the weld zone, which will also cause metal corrosion

Method used

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  • Wafer cutting fluid containing natural plant extracts
  • Wafer cutting fluid containing natural plant extracts
  • Wafer cutting fluid containing natural plant extracts

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0023] The preparation method of embodiment 1-12 is: add a certain amount of ultrapure water in the reactor, start stirring; add the natural plant extract according to the mass ratio, stir for 5 minutes; add the dispersant according to the mass ratio, stir for 5 minutes; Add penetrating agent and stir for 5 minutes; add organic phosphoric acid compound according to mass ratio, stir for 5 minutes; add solubilizer according to mass ratio, stir for 5 minutes; add antioxidant according to mass ratio, stir for 5 minutes; finally add pH adjustment according to mass ratio agent, stirred for 20 minutes, until transparent, that is, the wafer cutting liquid.

[0024] Table 1 Components and contents of the cutting fluid of Examples 1-12

[0025]

[0026]

[0027]

Embodiment 11

[0034] The detection of embodiment 11 metal corrosion

[0035] The effect detection of the following examples all adopts the following method: cut 12-inch AlDummy wafer with Disco 6362 wafer cutting machine, and the dilution factor of cutting fluid is 3000 times, after cutting, the wafer is placed in the air, respectively in 8 hours, 12 hours, Observe the surface corrosion for 24 hours and 36 hours.

[0036] Table 2 The particle residue results of Examples 1-10 and Comparative Example 1

[0037]

[0038] Among them: NG stands for: unqualified, OK: qualified.

[0039] With or without corrosion comparison picture figure 1 and figure 2 as shown, figure 1 It is the wafer surface after metallographic microscope observation after cutting in embodiment 1 after cutting, and the visible wafer Al Pad surface is not corroded in the figure; figure 2 It is the surface of the wafer cut by the cutting fluid in Comparative Example 1, and the Al Pad part circled in the figure has obv...

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Abstract

The invention discloses a wafer cutting fluid containing natural plant extracts, and belongs to the field of surface precision machining of photoelectronic devices. The cutting fluid contains natural plant extracts and is a compound with a heterocyclic structure in a series of molecular structures. Wherein the heterocyclic structure has one or more N atoms or S atoms, and in addition, the H atom on at least one C in the heterocyclic structure is substituted by an -NH2, -NO2, -CHO or -COOH functional group, and therefore the electron density of the N or S atoms in the heterocyclic structure can be improved; therefore, electrons on the metal surface can be combined into bonds more easily, a protective film is formed, and electrochemical corrosion of a bonding pad on the surface of a semiconductor wafer is inhibited.

Description

technical field [0001] The invention relates to a wafer cutting fluid containing natural plant extracts, which belongs to the field of surface precision processing of optoelectronic devices. Background technique [0002] In the semiconductor chip manufacturing process, the cutting process of the semiconductor wafer refers to a process in which the neatly distributed chips on the semiconductor wafer are separated by cutting the area called the dicing line after the semiconductor chip circuit manufacturing process is completed. . Observing under a 30x microscope, it can be found that the wafer semiconductor is composed of a collection of many independent units. These independent units are arranged neatly in rows or columns, and there is a "groove"-shaped strip between each row or column. These "grooves" are called cutting lines. After the cutting process is completed, individual tiny chips can be obtained. [0003] Usually thousands of chips are integrated on a semiconducto...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02C10N30/12C10N40/22
Inventor 侯军褚雨露
Owner 江苏奥首材料科技有限公司
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