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Preparation method of loudspeaker module

A loudspeaker module and loudspeaker technology, applied in the direction of sensors, electrical components, etc., can solve the problem of maximizing the space design of the acoustic cavity, which limits the development trend of the miniaturization of the speaker module, to maximize the space of the cavity, which is beneficial to the performance of the cavity, small size effect

Active Publication Date: 2021-04-09
SHENZHEN SUNWAY ACOUSTICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the development of miniaturization of electronic products, the space reserved for installing speakers in existing electronic products is getting smaller and smaller, and the acoustic performance of the speaker module depends on the volume of the sound cavity of the speaker module shell. Existing speaker module shells are generally made of plastic materials. In order to ensure the structural strength of the speaker module shells, the thickness of the speaker module shells made of plastic materials needs to be more than 0.7mm. The development trend of group miniaturization and the maximization of acoustic chamber space design

Method used

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  • Preparation method of loudspeaker module
  • Preparation method of loudspeaker module
  • Preparation method of loudspeaker module

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preparation example Construction

[0020] Please refer to Figure 1 to Figure 4 , a preparation method of a loudspeaker module, comprising the steps of:

[0021] S1. Form an enclosing structure 11 on the metal upper shell 1, so that the enclosing structure 11 encloses a cavity on the metal upper shell 1, wherein the enclosing structure 11 is provided with a cavity that communicates with the outside world The sound outlet 12;

[0022] S2. A plastic bracket 3 is formed on the metal upper shell 1 and the plastic bracket 3 is located in the cavity. The plastic bracket 3 includes a sound outlet 32 ​​arranged at the sound outlet 12 and for The support part 31 supporting the speaker unit 4, the sound outlet part 32 is provided with a sound outlet 33;

[0023] S3. Install the speaker unit 4 on the support portion 31, so that the metal upper shell 1, the plastic bracket 3 and the speaker unit 4 form a front acoustic cavity 7 connected to the sound outlet 33;

[0024] S4. Install the metal lower case 2 to the metal up...

Embodiment 1

[0043] Please refer to Figure 1 to Figure 4 , Embodiment 1 of the present invention is: a preparation method of a loudspeaker module, comprising the following steps:

[0044] S1. Form an enclosing structure 11 on the metal upper shell 1, so that the enclosing structure 11 encloses a cavity on the metal upper shell 1, wherein the enclosing structure 11 is provided with a cavity that communicates with the outside world The sound outlet 12;

[0045] Specifically, step S1 includes the following steps:

[0046] S11. Stamping the periphery of a piece of metal sheet, so that the periphery of the metal sheet is folded in the same direction to form the enclosing structure 11;

[0047] S12. Punching out the sound opening 12 on the metal sheet;

[0048] S13. Punching the avoidance groove 13 on the metal sheet;

[0049] Optionally, the step S1 may be carried out sequentially according to the processing sequence of S11, S12 and S13, or may be carried out sequentially according to the ...

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Abstract

The invention discloses a preparation method of a loudspeaker module, which comprises the following steps: S1, forming an enclosing structure on a metal upper shell, so that the enclosing structure encloses a cavity on the metal upper shell, and the enclosing structure is provided with a sound outlet for communicating the cavity with the outside; S2, forming a plastic support on the metal upper shell and located in the cavity, wherein the plastic support comprises a sound outlet part arranged at the sound outlet and a supporting part used for supporting the loudspeaker single body, and a sound outlet hole is formed in the sound outlet part; S3, installing a loudspeaker monomer on the supporting part, and enabling the metal upper shell, the plastic support and the loudspeaker monomer to form a front sound cavity communicated with the sound outlet hole in an enclosing manner; and S4, installing the metal lower shell on the metal upper shell, so that the metal upper shell, the plastic support, the loudspeaker monomer and the metal lower shell form a rear sound cavity. The plastic support is accommodated by the metal upper shell and the metal lower shell, maximization of the cavity space of the front vocal cavity and the rear vocal cavity is realized in a limited space, and improvement of the cavity performance is facilitated.

Description

technical field [0001] The invention relates to the technical field of acoustic devices, in particular to a method for preparing a loudspeaker module. Background technique [0002] With the advancement of technology, electronic products such as mobile phones, tablet computers, and various wearable electronic devices tend to be more and more miniaturized. How to reduce the volume of electronic products has become a very important part of electronic product design. [0003] At present, the common speakers mainly include dynamic speakers, electromagnetic speakers, capacitive speakers, piezoelectric speakers, etc. Among them, the dynamic speakers are relatively simple in production, low in cost, and have good low-frequency sound advantages. Some dynamic speakers are also called dynamic speaker modules, which usually include a speaker module housing and a speaker unit. The space between the diaphragm of the speaker unit and the speaker module housing forms a front acoustic cavity...

Claims

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Application Information

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IPC IPC(8): H04R31/00H04R9/06
CPCH04R31/00H04R9/06H04R2499/11
Inventor 钟秋明董庆宾
Owner SHENZHEN SUNWAY ACOUSTICS TECH CO LTD
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