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Hybrid packaging method and hybrid packaging structure applied to electronic device

A hybrid packaging and electronic device technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of high production cost, low work efficiency, unstable performance, etc., to reduce costs, reduce packaging thermal resistance, chip Stable performance

Pending Publication Date: 2021-04-02
KUNSHAN HUATAI ELECTRONICS TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0002] Lead frame packaged products (such as QFN / DFN package) can only mount a single chip or multiple chips to achieve circuit integration, but the internal structure of the chip cannot pass high current and high voltage, and the power cannot be too high, which cannot meet all market needs; Substrate packaging products (such as LGA / BGA package) can meet high current and high voltage, design circuit matching to realize chip integration, but cannot meet power devices with high heat dissipation requirements, unstable performance, low work efficiency, and high production cost

Method used

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  • Hybrid packaging method and hybrid packaging structure applied to electronic device
  • Hybrid packaging method and hybrid packaging structure applied to electronic device
  • Hybrid packaging method and hybrid packaging structure applied to electronic device

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Embodiment Construction

[0029] In view of the deficiencies in the prior art, the inventor of this case was able to propose the technical solution of the present invention after long-term research and extensive practice. The technical solution, its implementation process and principle will be further explained as follows. Unless otherwise specified, the processing techniques adopted in the embodiments of the present invention can be known to those skilled in the art.

[0030] The hybrid package structure can not only realize chip integration, but also meet high heat dissipation requirements and reduce costs. The mixed production scheme of substrate and lead frame is a brand-new circuit integration, high heat dissipation hybrid (Hybrid) package form, plastic packaging The body contains die attached and laminate (laminate) (the substrate contains components and chips). Using the maximum limit space in the plastic package, it can match the circuit to achieve chip integration, high-demand chip heat dissipa...

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Abstract

The invention discloses a hybrid packaging method and a hybrid packaging structure applied to an electronic device. The hybrid packaging method applied to the electronic device comprises the followingsteps: combining at least one substrate or at least one substrate with at least one first chip and a lead frame; and carrying out wire bonding processing on the lead frame combined with the substrateor the first chip and the substrate, and then performing packaging processing. The hybrid packaging method applied to the electronic device provided by the embodiment of the invention can be matchedwith a circuit to realize chip integration, high-requirement chip heat dissipation capability, reduction of packaging thermal resistance, stable chip performance, reduction of cost, reduction of the appearance volume of electronic equipment, improvement of the unit area use efficiency of a PCB and the like.

Description

technical field [0001] The invention particularly relates to a hybrid packaging method and a hybrid packaging structure applied to electronic devices, belonging to the technical field of semiconductor packaging. Background technique [0002] Lead frame packaged products (such as QFN / DFN package) can only mount a single chip or multiple chips to achieve circuit integration, but the internal structure of the chip cannot pass high current and high voltage, and the power cannot be too high, which cannot meet all market needs; Substrate packaging products (such as LGA / BGA package) can meet high current and high voltage, design circuit matching to realize chip integration, but cannot meet power devices with high heat dissipation requirements, unstable performance, low work efficiency, and high production cost. Contents of the invention [0003] The main purpose of the present invention is to provide a hybrid packaging method and a hybrid packaging structure applied to electronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L25/16H01L23/495H01L23/31H01L23/367
CPCH01L21/50H01L25/16H01L23/49575H01L23/3107H01L23/367H01L2224/32145H01L2224/73265H01L2224/49111H01L2224/49171H01L2224/32245H01L2224/48091H01L2924/181H01L2224/48137H01L2224/48247H01L2924/00012H01L2924/00014
Inventor 潘保顺彭虎
Owner KUNSHAN HUATAI ELECTRONICS TECH CO LTD
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