Wafer processing device and wafer processing method
A processing device and processing method technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of large total thickness deviation, low etching rate of wafer center, and low utilization rate of chemical liquid in wet cleaning equipment, etc. question
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[0009] Specific implementations of a wafer processing device and a wafer processing method provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0010] attached figure 1 Shown is a schematic structural diagram of the wafer processing device described in a specific embodiment of the present invention, including:
[0011] Wafer carrier, used to carry the wafer 104; a revolution drive device, the revolution drive device can drive the wafer carrier to rotate along a revolution axis OO', the revolution axis OO' is located outside the wafer carrier; A driving device, the rotation driving device can drive the wafer carrier to rotate along a rotation axis AA', the rotation axis AA' is located at the center of the wafer carrier and perpendicular to the surface of the wafer 104 .
[0012] The wafer carrier includes: a chuck 102, the chuck 102 is used to place the wafer 104, and can rotate; the chassis 101, the chassis 101 is ...
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