A method for selective plating of blind holes in the inner layer of ultra-thin plates

Abstract

The invention discloses a method for selective plating of inner layer blind holes of an ultra-thin plate. The selected area is used as the selected plating area, and the rest of the area is used as the non-plated area. The overall selected plating area is enlarged by 0.2mm to produce a negative film, and the non-plated area is exposed; development: develop the selected plating area; A thin layer of copper is deposited on the wall of the blind hole, and the dry film of the selected plating area is not damaged and peeled off during the copper sinking process; electroplating: electroplating the selected plating area, the electroplating conditions are 10ASF*51MIN, and the thickness of electroplating copper is 7-8μm, By setting the blind hole selection and plating process, the problems of board size deformation and blind hole depression value are solved, so as to ensure the product yield, reduce the risk of quality loss, greatly reduce the rework rate, effectively improve the process capacity, improve production efficiency, and improve production. Process core competitiveness.

Description

technical field [0001] The invention belongs to the technical field of PCB manufacturing, and in particular relates to a method for selective plating of blind holes in an inner layer of an ultra-thin board. Background technique [0002] In the existing technology, the general process design of the inner layer blind hole is laser drilling + immersion copper + hole filling electroplating. This kind of design is not suitable for stacked blind hole products with ultra-thin copper thickness, because the inner layer copper thickness is relatively thin According to the conventional process requirements, the board after hole filling and electroplating needs to be acid-etched to meet the copper thickness requirements. [0003] The production difficulties brought by conventional methods are: [0004] 1. The board that has been etched to reduce copper needs to be brushed to meet the roughness of the copper surface, but the thin board cannot be brushed and ground to easily cause dimens...

AI Technical Summary

Problems solved by technology

[0007] The embodiment of the present application provides a method for selective plating of blind holes in the inner layer of ultra-thin boards, and by setting the blind hole selective plating process, the problems of board size deformation and blind hole depression value are solved, thereby ensuring product yield and reducing The risk of quality loss greatly reduces the rework rate, effectively improves the process capability, improves production efficiency, and improves the core competitiveness of the production process

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