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Integrated co-fired inductor and preparation method thereof

A technology of co-firing and inductance, which is applied in the field of inductance, can solve the problems of reducing effective magnetic permeability, insufficient molding precision, and increasing process cost, etc., and achieves the effects of improving temperature stability, increasing anti-saturation ability, and reducing vibration and noise

Pending Publication Date: 2021-03-02
HENGDIAN GRP DMEGC MAGNETICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in this way of making inductors, several components need to be assembled together, and it is easy to introduce an additional air gap between the coil and the magnetic core, thereby reducing the effective magnetic permeability. Insufficient precision requires grinding, which increases the process cost and reduces the product yield

Method used

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  • Integrated co-fired inductor and preparation method thereof
  • Integrated co-fired inductor and preparation method thereof
  • Integrated co-fired inductor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] This embodiment provides a method for manufacturing an integrated co-fired inductor, and the method includes the following steps:

[0080] (1) Fill the mold cavity with 0.2g of the first magnetic powder, remove the enamelled wire from a flat copper wire 1 with a rectangular cross-section and place it on the surface of the first magnetic powder. , the length is 14mm, the width is 2.6mm, and the thickness is 0.3mm. The cavity is oscillated, the wire 1 is embedded in the first magnetic powder, and the first magnetic powder is smoothed; then 0.6g of the second magnetic powder is filled into the cavity, and the cavity is oscillated. Smooth the second magnetic powder; finally fill the mold cavity with 0.2g of the first magnetic powder, oscillate the mold cavity, and smooth the first magnetic powder;

[0081] (2) Mold the magnetic powder filled in the mold cavity, the molding method is hot pressing, and the hot pressing pressure is 300Mpa / cm 2 , the hot-pressing temperature i...

Embodiment 2

[0091] This embodiment provides a method for manufacturing an integrated co-fired inductor, and the method includes the following steps:

[0092] (1) Fill the mold cavity with 0.3g of the first magnetic powder, vibrate the mold cavity, and smooth the first magnetic powder; then fill in 0.5g of the second magnetic powder, remove the enamelled wire of a flat copper wire 1 with a rectangular cross section and place it on the second On the surface of the magnetic powder, both ends of the wire 1 extend out of the mold cavity. The shape of the wire 1 is S-shaped, with a length of 10mm, a width of 2.6mm, and a thickness of 0.30mm. The mold cavity is oscillated, and the wire 1 is embedded in the second magnetic powder, and the second magnetic powder is smoothed. ;Finally fill in 0.3g of the first magnetic powder, vibrate the mold cavity, and smooth the first magnetic powder;

[0093] (2) Mold the magnetic powder filled in the mold cavity, the molding method is hot pressing, and the ho...

Embodiment 3

[0103] This embodiment provides a method for manufacturing an integrated co-fired inductor, and the method includes the following steps:

[0104] (1) Fill the mold cavity with 0.2g of the first magnetic powder, vibrate the cavity, and smooth the first magnetic powder; then fill in 0.6g of the second magnetic powder, vibrate the mold cavity, and smooth the second magnetic powder; finally fill in 0.2g of the second magnetic powder A magnetic powder, a flat copper wire 1 with a rectangular cross-section is placed on the surface of the first magnetic powder after the enameled wire is removed, and the two ends of the wire 1 protrude from the mold cavity. mm, oscillating mold cavity, wire 1 embedded in the first magnetic powder, smoothing the first magnetic powder;

[0105] (2) Mold the magnetic powder filled in the mold cavity, the molding method is hot pressing, and the hot pressing pressure is 400Mpa / cm 2 , the hot-pressing temperature is 180°C, and the hot-pressing time is 30s;...

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Abstract

The invention provides an integrated co-fired inductor and a preparation method thereof. The preparation method comprises the steps: filling a mold cavity with magnetic powder in batches, wherein thetypes of every two adjacent layers of magnetic powder are different, at least one wire is embedded into one layer of magnetic powder, the two ends of each wire extend out of the mold cavity, and thencompression molding and heat treatment are sequentially conducted to obtain a magnetic core, and bending and tinning the wire extending out of the magnetic core to obtain the co-fired inductor. According to the preparation method provided by the invention, the inductor is prepared by adopting an integrated molding process, so that excessive assembly procedures of components are avoided, heat treatment is carried out after integrated molding, stress is fully released, hysteresis loss of materials is reduced, loss of devices is reduced under a light-load working condition, no extra gap exists between a wire and a magnetic core, and air gaps are uniformly distributed in the magnetic core; and the vibration noise of eddy current loss is reduced.

Description

technical field [0001] The invention belongs to the technical field of inductors, and relates to an integrated co-firing inductor and a preparation method thereof. Background technique [0002] In recent years, with the large-scale use of mobile devices, home appliances, automobiles, industrial equipment, data center servers, communication base station servers and other equipment, energy consumption has become a key consideration. The miniaturization, multi-function, high-performance, and power-saving of components continue to advance, and the mounted electronic components are required to be smaller / thinner and higher in performance. Improving efficiency and reducing heat generation in DC-DC converters are key conditions for the miniaturization of electronic components. In particular, core power supply circuits are increasingly required to be smaller / thinner, have low DC impedance, handle large currents, and be highly reliable, as the DC-DC converter ICs perform high-speed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/00H01F41/02H01F37/00H01F27/255H01F27/28H01F27/34H01F27/33
CPCH01F27/255H01F27/2823H01F27/33H01F27/34H01F37/00H01F41/00H01F41/0246H01F2027/348
Inventor 韩相华张丛金志洪徐君王林科张宁
Owner HENGDIAN GRP DMEGC MAGNETICS CO LTD
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