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Wafer carrier automatic screwing device

A driving device and carrier technology, applied in the direction of manufacturing tools, metal processing, metal processing equipment, etc., can solve problems such as low work efficiency, material tray or internal wafer damage, time-consuming and laborious unloading screws, etc., to reduce pollution and ensure Accuracy, avoiding the effect of exceeding the stroke

Active Publication Date: 2021-02-26
SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic unscrewing device for wafer carriers to solve the problem of time-consuming and laborious unscrew unloading during manual unloading, low work efficiency, and easy handling of trays or internal wafers. Technical issues causing damage

Method used

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  • Wafer carrier automatic screwing device
  • Wafer carrier automatic screwing device
  • Wafer carrier automatic screwing device

Examples

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Embodiment Construction

[0052] The present invention will be further described below in conjunction with specific embodiments. However, the purposes and purposes of these exemplary embodiments are only used to illustrate the present invention, and do not constitute any limitation to the actual protection scope of the present invention, nor do they limit the protection scope of the present invention.

[0053] like Figure 1 to Figure 4 As shown in the figure, this embodiment provides an automatic unscrewing device for a wafer carrier, including a frame 1, on which a double-speed chain conveyor line, a carrier positioning mechanism and an automatic unscrewing mechanism are provided. There are blocking cylinders 19, two sets of blocking cylinders 19 are arranged along the conveying direction of the double-speed chain conveyor line, and are respectively arranged at both ends of the carrier positioning mechanism, and the automatic screw-down mechanism is located above the carrier positioning mechanism.

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Abstract

The invention belongs to the technical field of wafer unloading, and provides a wafer carrier automatic screw unloading device. The wafer carrier automatic screw unloading device comprises a rack, a double-speed chain conveying line, a carrier positioning mechanism and an automatic screw unloading mechanism are arranged on the rack, blocking air cylinders are arranged on the double-speed chain conveying line, and the blocking air cylinders are arranged at the two ends of the carrier positioning mechanism separately. The automatic screw unloading mechanism is positioned above the carrier positioning mechanism. The carrier positioning mechanism comprises a lifting supporting plate driven by a piston cylinder, a positioning pin is arranged on the top face of the lifting supporting plate, a tray limiting block and a cover plate limiting plate are arranged on the two sides of the double-speed chain conveying line, in the positioning state, a wafer carrier is positioned and clamped between the lifting supporting plate and the tray limiting block and between the lifting supporting plate and the cover plate limiting plate, the tray limiting block extends to a tray of the wafer carrier, andthe cover plate limiting plate extends to a cover plate. According to the wafer carrier automatic screw unloading device, automatic screw unloading of the wafer carrier can be achieved, effective replacement of manual labor force is achieved, the working efficiency is greatly improved, and damage accidents caused to a material disc or an internal wafer are avoided.

Description

technical field [0001] The present invention relates to the technical field of wafer unloading, in particular to an automatic screw unloading device for a wafer carrier. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. During the production and processing of wafers, according to the requirements of the processing technology, the wafers need to be arranged in the wafer tray, and then the entire tray carrying the wafers is put into the plasma etching machine for ICP etching processing. After the ICP etching process, the wafers are sequentially taken out from the wafer tray for subsequent AFM tests, etc. The process of taking out the wafers from the wafer tray is called wafer unloading. [0003] At present, the unloading operation of the wafer in the feeding tray is usually done manually. When unloading, the cover plate needs to be removed from the carrie...

Claims

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Application Information

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IPC IPC(8): B23P19/00B23P19/06
CPCB23P19/001B23P19/06
Inventor 王子龙李凯杰陈仁明李健曹智
Owner SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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