Conductive adhesive film

A technology of conductive film and conductive adhesive layer, which is used in conductive adhesives, adhesives, epoxy resin adhesives, etc. and other problems to achieve the effect of improving the convenience of processing, prolonging the validity period of the product, and being easy to operate.

Pending Publication Date: 2021-02-23
铠博新材料(天津)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of moving the FPC, if the parts such as the reinforcing plate are not well fixed on the FPC sheet, it is easy to move
Existing products need to be refrigerated or stored away from light, otherwise, the viscosity will gradually weaken during storage at room temperature, and it will not be able to play the role of fixing the reinforcing plate during the flat laying process
[0004] The conductive film disclosed in the patent with the publication number CN 111073530 A has good shielding performance and conductive properties, but the adhesive film is slightly insufficient at room temperature, and cannot quickly fix small components such as reinforcing plates when laminating.
The anisotropic conductive film disclosed in the patent of Publication No. CN111100562 A adopts acrylic acid oligomer, and the adhesive film has good viscosity, but it needs to be refrigerated and stored away from light. After the adhesive film is stored at room temperature for a period of time, the viscosity weakens.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] After preparing the coated release film, prepare the conductive adhesive coating solution, the proportion is as follows:

[0044]

[0045]Dissolve the mixed solvent, polyamideimide resin, acrylic resin and phenolic epoxy resin in the dissolution tank and mix them evenly, then put them into the dispersion tank, add fumed silica and alumina powder, and disperse at high speed for 30 minutes. After sanding 3 times with a sand mill, add the material to the planetary mixer, add dendritic metal powder, vacuumize and stir for 60 minutes, add antioxidants, flame retardants and curing agents, and stir for another 30 minutes, and the conductive adhesive After filtering, apply a layer of conductive adhesive, and dry at a temperature of 90-110°C.

[0046] After the conductive film is aged at high temperature and high humidity (85°C, 85%RH) for 100 hours, it is flatly attached to a PI film or a reinforcing board, and laminated to a flexible circuit board at 180°C for performance t...

Embodiment 2

[0048] After preparing the coated release film, prepare the conductive adhesive coating solution, the proportion is as follows:

[0049]

[0050]

[0051] Dissolve the mixed solvent, polyamideimide resin, acrylic resin and phenolic epoxy resin in the dissolution tank and mix them evenly, then put them into the dispersion tank, add fumed silica and alumina powder, and disperse at high speed for 30 minutes. After sanding 3 times with a sand mill, add the material to the planetary mixer, add dendritic metal powder, vacuumize and stir for 60 minutes, add antioxidants, flame retardants and curing agents, and stir for another 30 minutes, and the conductive adhesive After filtering, apply a layer of conductive adhesive, and dry at a temperature of 90-110°C. .

[0052] After the conductive film is aged at high temperature and high humidity (85°C, 85%RH) for 100 hours, it is flatly attached to a PI film or a reinforcing board, and laminated to a flexible circuit board at 180°C f...

Embodiment 3

[0054] After preparing the coated release film, prepare the conductive adhesive coating solution, the proportion is as follows:

[0055]

[0056] Dissolve the mixed solvent, polyamideimide resin, acrylic resin and phenolic epoxy resin in the dissolution tank and mix them evenly, then put them into the dispersion tank, add fumed silica and alumina powder, and disperse at high speed for 30 minutes. After sanding 3 times with a sand mill, add the material to the planetary mixer, add dendritic metal powder, vacuumize and stir for 60 minutes, add antioxidants, flame retardants and curing agents, and stir for another 30 minutes, and the conductive adhesive After filtering, apply a layer of conductive adhesive, and dry at a temperature of 90-110°C. .

[0057] After the conductive film is aged at high temperature and high humidity (85°C, 85%RH) for 100 hours, it is flatly attached to a PI film or a reinforcing board, and laminated to a flexible circuit board at 180°C for performan...

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Abstract

The invention discloses a pressure-sensitive conductive film with a long validity period, the conductive film comprises a base material 1, a release layer 2 and a conductive adhesive layer 3, and theconductive adhesive layer is composed of organosilicon modified thermoplastic polyamide-imide, phenoxy epoxy resin, low Tg value acrylic resin, fumed silica, conductive metal powder, an antioxidant, aflame retardant, a latent curing agent and a mixed solvent. Compared with the prior art, the pressure-sensitive conductive film has the following advantages: the conductive adhesive layer has strongviscosity, does not need refrigeration storage, can be rapidly processed to the flexible substrate plate, and has excellent adhesion fastness, filling property and storage timeliness.

Description

technical field [0001] The invention relates to the field of conductive film for electronic circuit packaging, in particular to a pressure-sensitive conductive adhesive film with long storage period. Background technique [0002] With the demand for thinner and lighter electronic products, the flexible circuit board (FPC) market with excellent flexibility is growing and will become the mainstream in the future. At present, FPC uses PI film as the carrier base film, and the assembly of electronic components, the deployment and control of conductive lines, and electromagnetic shielding treatment are all carried out on the film. For positions with high requirements for anti-electromagnetic interference, such as camera modules and switch module positions, the conductivity, shielding and gluing performance of the conductive film are the key to the life cycle of the FPC. [0003] Before the conductive film is laminated, parts such as reinforcement boards are first placed, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/38C09J9/02C09J163/00C09J179/08C09J133/04C09J11/04C09J11/06
CPCC09J7/10C09J7/38C09J9/02C09J163/00C09J11/04C09J11/06C08L2205/03C08L2201/08C08L2201/02C08K2003/2227C08K2003/085C08K2003/0806C09J2467/005C08L79/08C08L33/04C08K13/06C08K3/36C08K9/02C08K7/00C08K3/08C08K3/22C08K5/1345
Inventor 郑妙生黄海江
Owner 铠博新材料(天津)有限公司
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