A laser processing system and method for monitoring changes in laser power

Abstract

The invention provides a laser processing system and method for monitoring changes in laser power, including: a laser, a beam expander, a first beam splitter, a positive lens, a second beam splitter, an integrating rod, an energy detector, a negative lens, a PSD Detector, cutting head and workpiece table; wherein the laser energy monitoring system adjusts the output power of the laser to keep the laser power stable during laser processing; the position detection system monitors the position change of the laser beam output by the laser; the first The beam splitter and the cutting head are respectively placed on respective one-dimensional motion platforms, and the center of the laser beam is driven to move along the horizontal direction and the cutting head along the horizontal direction by driving the first beam splitter Always keep coincident with the optical axis of the cutting head. The invention patent ensures the good consistency of the cut material during the long-term laser processing process, and the long-term and effective guarantee for the yield rate of laser processing in industrial applications.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser processing system for monitoring changes in laser power and position. Background technique [0002] As a popular processing technology emerging in recent years, laser processing has been gradually applied to many industries. As the core component of the laser processing equipment - the laser, its performance directly affects the laser processing effect; especially in the long-term use of the laser, there is a position drift of the spot and a power attenuation. The current laser processing equipment has no laser dose and Position monitoring system, so that when the laser processing equipment cuts materials in long-term use, the cutting effect is that the consistency of material cutting is not good; if the possible problems of the laser processing system are checked, it will take a lot of time to detect and Readjust the laser optical path, and there will be similar problems...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the above-mentioned technical defects, provide a laser processing system that monitors laser power and position changes, and solve the problem of poor laser cutting consistency and yield caused by long-term laser stability in existing laser processing systems The problem

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