Laser processing system and method for monitoring laser power changes

Abstract

The invention provides a laser processing system and method for monitoring laser power changes. The laser processing system comprises a high-power laser device, a beam expander, a first beam splitter,a positive lens, a second beam splitter, an integrating rod, an energy detector, a negative lens, a PSD detector, a cutting head and a workpiece table. A laser energy detection system adjusts the emergent power of the high-power laser device, so that the laser power in the laser processing process is kept stable. A position detection system monitors the position change condition of a laser beam emitted by the laser device. The first beam splitter and the cutting head are placed on respective one-dimensional motion platforms correspondingly, and the center of the laser beam is always kept coinciding with the optical axis of the cutting head by driving the first beam splitter to move in the horizontal direction and driving the cutting head to move in the horizontal orthogonal direction. Inthe long-term laser processing process, it is guaranteed that cut materials have good consistency, and the yield of laser processing in industrial application is effectively guaranteed for a long term.

Description

Technical field[0001]The invention relates to the field of laser processing, in particular to a laser processing system that monitors changes in laser power and position.Background technique[0002]As a popular processing technology that has emerged in recent years, laser processing has been gradually applied to many industries. As the core component of laser processing equipment-laser, its performance directly affects the laser processing effect; especially the position drift of the spot and the attenuation of power during the long-term use of the laser. There is no laser dosage and Position monitoring system, so that when the laser processing equipment cuts materials during long-term use, the cutting effect is that the consistency of the material cutting is not good; if you check the possible problems of the laser processing system, it will take a lot of time to detect and Re-adjust the laser light path, and similar problems will still exist after laser processing equipment is used ...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the above-mentioned technical defects, provide a laser processing system that monitors laser power and position changes, and solve the problem of poor laser cutting consistency and yield caused by long-term laser stability in existing laser processing systems The problem

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