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A polishing machine with functions of in-situ measurement and trimming of disk surface

A polishing machine and disk surface technology, applied in surface polishing machine tools, grinding/polishing equipment, manufacturing tools, etc., can solve problems such as inaccurate measurement results, and achieve increased complexity, uniform removal rate distribution, and accurate processing stability. Effect

Active Publication Date: 2022-03-29
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the surface shape of the polishing disc is measured by equipment such as a flatness meter or a three-coordinate measuring machine, the polishing disc needs to be disassembled, but new deformation will be introduced during the secondary clamping process, resulting in inaccurate measurement results

Method used

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  • A polishing machine with functions of in-situ measurement and trimming of disk surface
  • A polishing machine with functions of in-situ measurement and trimming of disk surface
  • A polishing machine with functions of in-situ measurement and trimming of disk surface

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Embodiment Construction

[0038] The present invention will be further described below in conjunction with the accompanying drawings. Such as Figure 1-11 As shown, a polishing machine with in-situ measurement and trimming functions of the disc surface includes a base 1, a spindle 2, a polishing disc 3, a support unit, a feed unit, a measuring unit, a trimming unit and a computer; the base 1 is a triangular shape Structure, the upper surface has four mounting surfaces, which are machined in one pass, one of which is located in the center for the spindle 2, and the remaining three mounting surfaces are located at the three corners for mounting the support unit ; The diameter of the polishing disc 3 is greater than or equal to 20000mm, installed above the main shaft 2 and coaxial with the main shaft 2, and the main shaft 2 provides power for the rotation of the polishing disc 3;

[0039] The feeding unit, measuring unit and trimming unit are respectively installed on the supporting unit;

[0040]The su...

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Abstract

The invention discloses a polishing machine with in-situ measurement and trimming functions of the disc surface, comprising a base, a main shaft, a polishing disc, a support unit, a feeding unit, a measuring unit, a trimming unit and a computer; the feeding unit, the measuring unit Installed on the supporting unit separately from the trimming unit. The invention supports double-station simultaneous polishing. The feed unit can drive the workpiece to move along a complex trajectory during processing, thereby improving the uniformity of contact between the workpiece and the polishing disc, thereby improving the polishing accuracy. The measuring unit can measure the surface shape of the polishing disc in situ, and evaluate the processing stability of the polishing machine, so as to guide the dressing or replacement of the polishing disc surface. The trimming unit can trim the surface of the polishing disc in situ to improve the surface shape accuracy, thereby ensuring the processing accuracy of the polishing machine. The invention realizes in-situ trimming of the surface shape of the polishing disk, keeps the polishing machine in a good processing state all the time, further ensures the surface shape accuracy and surface quality of the workpiece, and reduces the reject rate.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to the polishing process of large-scale planar components such as laser crystals, sapphires, and optical windows, and can also be used for the polishing process of materials such as ceramic chips and silicon chips. Specifically relates to a polishing machine with the functions of in-situ measurement and trimming of the disc surface. Background technique [0002] During the polishing process, the rotation of the workpiece and the reciprocating motion of the workpiece along the radial direction of the polishing disc can increase the complexity of the relative motion between the workpiece and the polishing disc, so that the contact between each point on the processing surface and the surface of the polishing disc is more precise. The distribution of the removal rate is more uniform, so that the surface shape of the polished workpiece is higher and the surface qual...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B29/02B24B41/02B24B41/04B24B47/12B24B47/20
CPCB24B29/02B24B41/02B24B41/04B24B47/12B24B47/20
Inventor 朱祥龙康仁科董志刚马堃徐嘉慧金洙吉
Owner DALIAN UNIV OF TECH
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