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Polishing machine with disc surface in-place measuring and finishing functions

A polishing machine and disc surface technology, which is applied to surface polishing machine tools, grinding/polishing equipment, manufacturing tools, etc., can solve problems such as inaccurate measurement results, and achieve the effects of increasing complexity, high surface shape accuracy, and accurate evaluation

Active Publication Date: 2021-01-01
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the surface shape of the polishing disc is measured by equipment such as a flatness meter or a three-coordinate measuring machine, the polishing disc needs to be disassembled, but new deformation will be introduced during the secondary clamping process, resulting in inaccurate measurement results

Method used

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  • Polishing machine with disc surface in-place measuring and finishing functions
  • Polishing machine with disc surface in-place measuring and finishing functions
  • Polishing machine with disc surface in-place measuring and finishing functions

Examples

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Embodiment Construction

[0038] The present invention will be further described below in conjunction with the accompanying drawings. Such as Figure 1-11 As shown, a polishing machine with in-situ measurement and trimming functions of the disc surface includes a base 1, a spindle 2, a polishing disc 3, a support unit, a feed unit, a measuring unit, a trimming unit and a computer; the base 1 is a triangular shape Structure, the upper surface has four mounting surfaces, which are machined in one pass, one of which is located in the center for the spindle 2, and the remaining three mounting surfaces are located at the three corners for mounting the support unit ; The diameter of the polishing disc 3 is greater than or equal to 20000mm, installed above the main shaft 2 and coaxial with the main shaft 2, and the main shaft 2 provides power for the rotation of the polishing disc 3;

[0039] The feeding unit, measuring unit and trimming unit are respectively installed on the supporting unit;

[0040]The su...

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PUM

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Abstract

The invention discloses a polishing machine with disc surface in-place measuring and finishing functions. The polishing machine comprises a base, a main shaft, a polishing disc, a supporting unit, a feeding unit, a measuring unit, a finishing unit and a computer, wherein the feeding unit, the measuring unit and the finishing unit are arranged on the supporting unit. The double-station polishing machine supports double-station simultaneous polishing machining. The feeding unit can drive a workpiece to move along a complex track in the machining process, so that the contact uniformity of the workpiece and the polishing disc is improved, and the polishing precision is improved. The measuring unit can measure the surface shape of the surface of the polishing disc in place and evaluate the machining stability of the polishing machine, and therefore finishing or replacement of the surface of the polishing disc is guided. The finishing unit can finish the surface of the polishing disc in place, the surface shape precision is improved, and then the machining precision of the polishing machine is guaranteed. In-place finishing of the surface shape of the polishing disc is achieved, the polishing machine is kept in a good machining state all the time, then the surface shape precision and the surface quality of the workpiece are guaranteed, and the rejection rate is reduced.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to the polishing process of large-scale planar components such as laser crystals, sapphires, and optical windows, and can also be used for the polishing process of materials such as ceramic chips and silicon chips. Specifically relates to a polishing machine with the functions of in-situ measurement and trimming of the disc surface. Background technique [0002] During the polishing process, the rotation of the workpiece and the reciprocating motion of the workpiece along the radial direction of the polishing disc can increase the complexity of the relative motion between the workpiece and the polishing disc, so that the contact between each point on the processing surface and the surface of the polishing disc is more precise. The distribution of the removal rate is more uniform, so that the surface shape of the polished workpiece is higher and the surface qual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/02B24B41/04B24B47/12B24B47/20
CPCB24B29/02B24B41/02B24B41/04B24B47/12B24B47/20
Inventor 朱祥龙康仁科董志刚马堃徐嘉慧金洙吉
Owner DALIAN UNIV OF TECH
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