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Etching liquid for copper foils, method for producing printed wiring board using said etching liquid, etching liquid for electrolytic copper layers, and method for producing copper pillar with electrolytic copper layers

A technology of etching solution and electrolytic copper, which is applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc.

Active Publication Date: 2020-12-08
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the etching of the electrolytic copper layer, etching (side etching) of the electrolytic copper layer along the side wall of the resist constituting the resist pattern may occur, which is a problem.

Method used

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  • Etching liquid for copper foils, method for producing printed wiring board using said etching liquid, etching liquid for electrolytic copper layers, and method for producing copper pillar with electrolytic copper layers
  • Etching liquid for copper foils, method for producing printed wiring board using said etching liquid, etching liquid for electrolytic copper layers, and method for producing copper pillar with electrolytic copper layers
  • Etching liquid for copper foils, method for producing printed wiring board using said etching liquid, etching liquid for electrolytic copper layers, and method for producing copper pillar with electrolytic copper layers

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Effect test

preparation example Construction

[0075] [Preparation of etching solution]

[0076] The etching solution of the present invention can be prepared by uniformly stirring (A) component, (B) component, (C) component, and other components as needed. The stirring method of these components is not particularly limited, and the stirring method generally used in the preparation of etching solution can be adopted.

[0077] [Use of etching solution]

[0078] The etching liquid of this invention can be used suitably for etching of copper foil. For example, the etchant of the present invention can be suitably used for etching copper foil in an ETS process. In addition, the etchant of the present invention can be used for other uses requiring etching of copper foil in addition to etching of copper foil in the ETS process.

[0079] According to a preferred aspect of the present invention, by performing etching using the etching solution of the present invention, the etching rate and wiring shape become more favorable. In...

Embodiment 1

[0150] Into a glass beaker with a capacity of 1 L, 0.949 kg of pure water, 0.033 kg of hydrogen peroxide (A) (manufactured by Mitsubishi Gas Chemical Co., Ltd., 60% by mass, molecular weight 34) and sulfuric acid (B) (manufactured by Mitsubishi Gas Chemical Co., Ltd.) were charged. , 46% by mass of dilute sulfuric acid, 0.017 kg of molecular weight (98), and 0.0003 kg of 5-amino-1H-tetrazole (manufactured by Masuda Chemical Industry Co., Ltd.) as the azole compound (C). Stirring is performed to form a uniform state, and an etching solution is prepared.

[0151] Using this etchant, the substrate for evaluation was subjected to a spray process of etching to a thickness of 8 μm of copper foil at a liquid temperature of 30° C. and a spray pressure of 0.15 MPa.

[0152] In order to determine the etching treatment time for copper foil with a thickness of 8 μm, the entire copper foil substrate (size 40mm×40mm) was sprayed for 60 seconds at a liquid temperature of 30°C, and the amount...

Embodiment 2

[0157] An etching solution was prepared in the same manner as in Example 1 except that phenylurea was used in the quantitative ratio described in Table 1, and after spraying the substrate for evaluation, the amount of side etching was evaluated.

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Abstract

The present invention relates to: an etching liquid for copper foils, which is capable of etching a copper foil, while suppressing the occurrence of side etching of a copper wiring line; and a methodfor etching a copper foil and a method for producing a printed wiring board, each of which uses this etching liquid for copper foils. The present invention also relates to: an etching liquid for electrolytic copper layers, which is capable of etching an electrolytic copper layer, while suppressing the occurrence of side etching of the electrolytic copper layer; and a method for etching an electrolytic copper layer and a method for producing a copper pillar, each of which uses this etching liquid for electrolytic copper layers. An etching liquid according to the present invention is characterized by containing (A) hydrogen peroxide, (B) sulfuric acid and (C) at least one azole compound that is selected from the group consisting of 5-amino-1H-tetrazole, 1, 5-pentamethylenetetrazole and 2-n-undecylimidazole. This etching liquid is also characterized in that: the molar ratio of the hydrogen peroxide (A) to the sulfuric acid (B) is within the range of 6-30; the concentration of the azole compound (C) is within the range of 0.001-0.01% by mass; and phosphoric acid is not substantially contained therein.

Description

technical field [0001] The present invention relates to an etchant for copper foil and a method for producing a printed wiring board using the same. Moreover, this invention relates to the manufacturing method of the etchant for electrolytic copper layers, and the copper pillar using the same. Background technique [0002] When forming copper wiring on a printed circuit board, a coreless substrate (Embedded Trace Substrate) process (hereinafter referred to as "ETS process") is known as one of copper wiring miniaturization methods (Patent Documents 1 and 2). [0003] In the ETS process, the reduction in the width of the copper wiring is small, and the formation of fine wiring can be realized. However, in the ETS process, when copper foil is etched, etching (side etching) of copper wiring along the side wall of the interlayer insulating resin may occur, which is a problem (Patent Document 3). [0004] In addition, in the manufacture of semiconductor packages, copper pillars ...

Claims

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Application Information

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IPC IPC(8): C23F1/18H05K3/06
CPCC23F1/18H05K3/06H05K3/067
Inventor 瀬户一彰玉井聪松永裕嗣
Owner MITSUBISHI GAS CHEM CO INC
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