Etching solution, replenishing solution, and method of forming copper wiring

Abstract

The invention relates to an etching solution, a supplying solution and a method of forming copper wiring. The etching solution can inhibit lateral etching, increase linearity of the copper wiring, and inhibit residue of non-etched portion. The etching solution is characterized in that the etching solution is an etching solution of copper and an aqueous solution containing acid, cupric ions, azole compounds and alicyclic amine compounds. The supplying solution is characterized in that the supplying solution is added into the etching solution when the etching solution is continuously or repeatedly used, and is an aqueous solution containing acid, azole compounds and alicyclic amine compounds. The method of forming the copper wiring (1) is characterized by etching non-covered portion of the copper layer by a resist (2) and using the etching solution provided by the invention to etch.

Description

technical field [0001] The present invention relates to a copper etching solution, its supply solution, and a method for forming copper wiring. Background technique [0002] In the manufacture of printed wiring boards, when copper wiring patterns are formed by photolithography, ferric chloride-based etchant, copper chloride-based etchant, alkaline etchant, etc. are used as etchant. When these etching solutions are used, copper under the resist may be dissolved from the side of the wiring pattern, which is called side etching. That is, it is expected that the portion covered with the resist that is not removed by etching (that is, the copper wiring portion) is removed by the etchant, thereby gradually reducing the width of the copper wiring from the bottom to the top. Especially when the copper wiring pattern is fine, it is necessary to reduce such lateral etching as much as possible. In order to suppress this lateral etching, an etchant containing an azole compound has bee...

AI Technical Summary

Problems solved by technology

However, if such an etchant is used in the usual way, side gaps (がたつき) may occur on the side of the copper wiring

If there is a backlash on the side of the copper wiring, the linearity of the copper wiring will decrease, which may cause misidentification when optically inspecting the width of the copper wiring from above the printed wiring board.

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