Micro-nano boron nitride particles with high thermal conductivity and its preparation method and application

A technology of boron nitride particles and high thermal conductivity, which is applied in the ball milling treatment of surface modification of high thermal conductivity micro-nano filler boron nitride particles, and the field of high thermal conductivity composite insulating materials, which can solve the problem of shortening the service life of devices, poor thermal conductivity, high viscosity, etc. problems, to achieve the effect of reducing potting viscosity, excellent thermal conductivity, and stable electrical insulation performance

Active Publication Date: 2022-04-15
SUZHOU JUFENG ELECTRICAL INSULATION SYST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The biggest defect in the application of epoxy potting glue is poor thermal conductivity and high viscosity, which reduces the service life of the device. In order to meet the market demand, it is necessary to modify the traditional epoxy potting glue. The modified inorganic micro-nano thermal conductive filler can improve the thermal conductivity of the composite material and ensure its electrical insulation performance

Method used

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  • Micro-nano boron nitride particles with high thermal conductivity and its preparation method and application

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Soak 1Kg of commercially available boron nitride micro-nano flakes (diameter 50 microns) in hydrogen peroxide (30wt%), the hydrogen peroxide is submerged in boron nitride, filter after 2 hours, wash the filter cake with water for 3 times, and then dry to obtain hydrogen peroxide treated nitrogen Boron oxide; add 1Kg hydrogen peroxide treated boron nitride, 20g silane coupling agent (2wt%, composed of 10g KH560 and 10g KH550) into the disperser, disperse at 1200rpm for 3 minutes, stop for 1 minute, then disperse at 1200rpm for 3 minutes, stop for 1 minute Minutes, and then disperse at 1200rpm for 3 minutes for surface treatment to obtain surface-treated boron nitride particles; used for the following experiments.

Embodiment 2

[0020] The distribution of large: medium: small is 10%: 30%: 60%, the diameter of the large ball is 3mm, the diameter of the medium ball is 1.5mm, and the diameter of the small ball is 0.5mm; the revolution speed is 240r / min.

[0021] The specific preparation method is as follows:

[0022] Using the dry ball milling method, put the same amount of boron nitride micro-nano flakes into the four ball milling tanks of the planetary ball mill, and select the ball ratio as large: medium: small (10%: 30%: 60%). In principle, the materials, balls, and grinding space each occupy 1 / 3, the speed is selected as 240r / min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, Inverted for 30 minutes, cooled, and dried to obtain micro-nano boron nitride particles with high thermal conductivity.

Embodiment 3

[0024] The distribution of large: medium: small is 10%: 30%: 60%, the diameter of the large ball is 3mm, the diameter of the medium ball is 1.5mm, and the diameter of the small ball is 0.5mm; the revolution speed is 220r / min.

[0025] The specific preparation method is as follows:

[0026] Using the dry ball milling method, put the same amount of boron nitride micro-nano flakes into the four ball milling tanks of the planetary ball mill, and select the ball ratio as large, medium and small (10%: 30%: 60%). In principle, the materials, balls, and grinding space each occupy 1 / 3, the speed is selected as 220r / min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, reverse rotation for 30min, cooling for 5min, forward rotation for 30min, Inverted for 30 minutes, cooled, and dried to obtain micro-nano boron nitride particles with high thermal conductivity.

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Abstract

The invention discloses a high thermal conductivity micro-nano boron nitride particle and its preparation method and application. Ball milling technology is used to modify the surface of the boron nitride particle, and the boron nitride particle is hydrogen peroxide and a silane coupling agent. Treated boron nitride micro-nanosheets. The purpose of the present invention is to make the boron nitride particles form a thermal conduction path in the resin after grinding, and reduce the viscosity, so as to realize the characteristics of excellent thermal conductivity and insulation performance of the high thermal conductivity composite insulating material with a single particle size filler and low filling amount. It can be used in various industries that require thermal conductivity and insulation performance, such as in the field of electrical and electronic equipment, which can not only maintain its effective insulation and heat dissipation, but also reduce product viscosity and increase its operability; especially the present invention The adhesion of the thermally conductive resin system is improved by a new modification method.

Description

technical field [0001] The invention relates to a special surface treatment technology for high thermal conductivity micro-nano fillers, in particular to a ball milling treatment technology for surface modification of high thermal conductivity micro-nano filler boron nitride particles, which can be mixed with epoxy resin to prepare high thermal conductivity composite materials. Insulation Materials. Background technique [0002] With the development of electrical equipment to high power density and small and light weight, and the development of microelectronics and integrated circuits to high speed and high density, the corresponding packaging technology requirements are also getting higher and higher. As we all know, the packaging effect directly affects electrical equipment. The service life of the equipment, the heat generated in the unit volume of the equipment increases sharply, and the poor packaging effect will lead to the continuous accumulation of these heat, which ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K13/06C08K9/00C08K9/02C08K9/06C08K7/00C08K3/38C08L63/00
CPCC08K13/06C08K9/00C08K9/02C08K9/06C08K7/00C08K3/38C08K2201/011C08K2201/005C08K2003/385C08L63/00
Inventor 田付强刘艳婷夏宇
Owner SUZHOU JUFENG ELECTRICAL INSULATION SYST
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