Adhesive dispensing machine for semiconductor apparatus

Abstract

The invention discloses an adhesive dispensing machine for a semiconductor apparatus. The adhesive dispensing machine is characterized by structurally comprising a machine body, an adhesive dispensingmachine body, a conveyor and a control panel, wherein the adhesive dispensing machine body is mounted on the top center position of the front surface of the machine body; and the conveyor is arrangedon the top surface of the machine body. While the adhesive dispensing machine is used to perform adhesive dispensing on the semiconductor apparatus, a telescopic tube moves vertically inside an adhesive dispensing tube according to amount of inlet adhesive inside the adhesive dispensing tube so as to reduce residual adhesive on the outer wall of the adhesive dispensing tube, so that direct contact between the adhesive dispensing tube and the surface of the apparatus is favorably reduced, the outer wall of the adhesive dispensing tube is kept clean, an adhesive drawing phenomenon is reduced, aqualification rate of semiconductor apparatus processing is favorably increased, and processed defective products are reduced; the outer wall of the telescopic tube is increased as part of adhesive is easily left on the outer wall of the telescopic tube; the telescopic tube moves vertically to movably fit to the inner part of a blocking block, and a clearing block clears a little adhesive left outside, so that the telescopic tube freely moves up and down inside the adhesive dispensing tube, and therefore, adhesive dispensing for the semiconductor apparatus is favorably quickened.

Description

technical field [0001] The invention belongs to the field of semiconductors, and more specifically, relates to a semiconductor device dispensing machine. Background technique [0002] Due to the controllable conductivity of semiconductors, semiconductor devices are widely used in various fields such as integrated circuits and lighting. When processing semiconductor devices, different semiconductor materials are glued on the surface of the material through a glue dispenser; In the prior art, when using a glue dispenser to dispense glue to semiconductor devices, because part of the glue is in a relatively viscous fluid state, when the dispensing tube is in contact with the semiconductor material, a small amount of glue adheres to the outside of the dispensing tube, and the workload of dispensing increases. , and the glue on the outside of the dispensing tube increases. When the dispensing tube moves up and down, the glue will drip down by gravity to form a wire drawing phenome...

AI Technical Summary

Problems solved by technology

[0002] Due to the controllable conductivity of semiconductors, semiconductor devices are widely used in various fields such as integrated circuits and lighting. When processing semiconductor devices, different semiconductor materials are coated with glue on the surface of the material by a dispenser and bonded; In the prior art, when a glue dispenser is used to dispense glue to semiconductor devices, because part of the glue is in a relatively viscous fluid state, when the dispensing tube is in contact with the semiconductor material, a small amount of glue adheres to the outside of the dispensing tube, and the workload of dispensing increases. , and the glue on the outside of the dispensing tube increases. When the dispensing tube moves up and down, the glue will drip down by gravity to form a wire drawing phenomenon, and it will easily drop on the non-dispensing position of the semiconductor device, which will affect the use of semiconductor devices and increase semiconductor defective products.

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