Method for removing melting solder paste gas holes on heat pipe radiator

Abstract

The invention discloses a method for removing melting solder paste gas holes on a heat pipe radiator. The method includes the steps that S1: at least a heat pipe and a base are provided, and a heat pipe slot is formed in the base; S2: the heat pipe and the heat pipe slot are made to be in clearance fit, solder paste is applied in a clearance between the heat pipe and the heat pipe slot, and then the heat pipe and the base are locked and fixed through a mold and placed in a heating furnace to be heated, so that the solder paste is melted; and S3: the mold and the heat pipe radiator are taken out from the heating furnace, then the mold and a heat pipe heater are placed on a vibration device and are fixed on the vibration device through a fixture, the vibration device is started to vibrate the heat pipe heater, and the molten solder paste flows and fills the gas holes quickly through vibration. The method can remove the gas holes inside a metal compound at the welding interface of the heat pipe radiator in time, improve the welding quality of the heat pipe radiator, so as to improve the heat dissipation performance of the heat pipe radiator.

Description

technical field [0001] The invention relates to the technical field of heat pipe radiators, in particular to a method for removing air pockets of molten solder paste in a heat pipe radiator. Background technique [0002] Heat pipe radiators have been widely used in various occasions that require heat dissipation due to the advantages of heat pipes such as high thermal conductivity, light weight, simple structure, low price, and the ability to transfer a large amount of heat without electricity. For example, the rapid conduction and heat dissipation of integrated devices with high heat generation such as electronic heating components such as CPU can effectively reduce the heat accumulation caused by the heating of electronic heating components and ensure the normal operation of electronic components. [0003] The heat pipe radiator specifically includes at least a base and a heat pipe. The top surface of the base is used to contact the heat source, and the top surface of the ...

AI Technical Summary

Problems solved by technology

[0005] However, in practice, after the solder paste is heated and melted, the internal impurities (such as rosin) overflow, and these impurities will form air holes inside the solder paste. It will cool inside, causing the internal air of the metal compound on the welding interface of the heat pipe radiator to solidify if it is not discharged in time, resulting in residual air holes inside, which will increase the contact thermal resistance and affect the heat dissipation effect

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