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Solid glue preparing and forming technology

A molding process and glue technology, which is applied in the field of solid glue preparation and molding process, can solve the problems of insufficient smooth surface, uneven density of glue sticks, inability to guarantee the concentration of glue liquid and filling uniformity, etc. Smooth walls and uniform density

Inactive Publication Date: 2020-11-20
广州鑫泽化工科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (2) In the process of filling the glue solution, it is impossible to ensure that the concentration of the glue solution in the mold is consistent with the filling uniformity. After the glue solution is poured into the mold, it has been in a static state until the glue solution is solidified and formed in the mold. After that, it is easy to have uneven density everywhere on the glue stick and the surface is not smooth enough, which affects the appearance quality of the product

Method used

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Embodiment Construction

[0035] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.

[0036] like Figure 1 to Figure 8 Shown, a kind of solid glue preparation molding process, it has used a kind of molding equipment, and this molding equipment comprises bottom plate 1, top plate 2, belt conveyor 3, feeding device 4 and filling device 5, adopts above-mentioned molding equipment to The specific technological process when solid glue is molded is as follows:

[0037] S1. Glue preparation: use bone glue as an adhesive for solid glue, stearic acid as a gelling agent, ethylene glycol as a plasticizer and humectant, and borax as a preservative to prepare a glue solution. The ratio is as follows: bone glue 60g, stearin 10g acid, 8ml ethylene glycol, 10g borax, 1.6g sodium hydroxide, 250ml water;

[0038] S2. base is fixed: the solid glue she...

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Abstract

The invention relates to a solid glue preparing and forming technology which adopts forming equipment. The forming equipment comprises a bottom plate, a top plate, a belt conveyor, a placing device and a filling device. The specific technological processes of adopting the forming equipment to form solid glue are as follows: preparing glue solution, fixing a base, filling glue solution, cooling, solidifying and assembling accessories. The placing device comprises a placing seat, a lifting rod, a connecting plate, a lifting air cylinder, a conveyor belt, a driven gear, a driving gear and a drivemotor. According to the forming equipment, the placing device is adopted to fix the base; the base can rotate along with the placing device to be cooperated with the filling device to uniformly fillglue solution on a support plate; and during the filling process, a sizing cylinder can be adopted to position glue solution, so that the roundness of the surface of a prepared glue stick can be ensured after glue solution solidifies, and the glue solution is enabled to be uniformly distributed through intermittent vibration.

Description

technical field [0001] The invention relates to the field of solid glue processing, in particular to a solid glue preparation and molding process. Background technique [0002] Solid glue is a kind of ideal and beautiful adhesive. It is a solid adhesive formed by injecting hot liquid into the mold, turning it into a solid after cooling, and putting it into a lipstick tube. Solid glue has the advantages of being easy to carry and use, not polluting areas other than the bonding surface, having strong adhesive force, and being able to maintain adhesiveness for a long time. [0003] Usually, to make solid glue, it needs to go through steps such as glue preparation, glue stick molding, glue stick installation and other accessories installation. After the glue stick is formed, the glue stick is installed on the corresponding accessories. During this process, the following problems exist: [0004] (1) Fill the prepared glue into the forming mold and wait for the glue to solidify a...

Claims

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Application Information

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IPC IPC(8): B29C39/02B29C39/22B29C39/24C09J189/00C09J11/04C09J11/06
CPCB29C39/02B29C39/22B29C39/24C08K2003/387C09J11/04C09J11/06C09J189/00C08K13/02C08K3/38C08K5/09C08K5/053
Inventor 许旭安聪聪
Owner 广州鑫泽化工科技有限公司
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