A kind of unsealing method of molded solid tantalum capacitor

Abstract

The invention discloses a method for unsealing a molded solid tantalum capacitor. The molded solid tantalum capacitor to be unsealed comprises a tantalum core and an encapsulation material layer for encapsulating the tantalum core; Sealing material layer to expose the internal tantalum core; remove the conductive connection layer and the cathode layer with a reagent that can catalyze the reaction with the cathode layer to expose the dielectric layer; use organic solvent to clean the dielectric layer; use the inlay liquid along the section direction of the tantalum core Mount the tantalum core with the exposed dielectric layer; grind the mounted tantalum core until the anode body, the dielectric layer, and the interface layer between the anode body and the dielectric layer to be observed are exposed. The beneficial effects of the present invention are that the molded solid tantalum capacitor can be unsealed by a combination of wet etching and mechanical methods, so as to ensure that the internal dielectric layer and anode body of the tantalum capacitor can be completely observed after unsealing, so as to meet the inspection requirements of failure analysis.

Description

technical field [0001] The invention relates to the field of failure analysis of tantalum capacitors, in particular to a method for unsealing a molded solid tantalum capacitor. Background technique [0002] Molded solid tantalum capacitors are made by sintering tantalum powder at high temperature to form an anode tantalum block with a porous structure, forming a tantalum pentoxide dielectric layer on the surface of tantalum, depositing manganese dioxide outside the dielectric layer as a cathode, and covering the outermost layer with a ring Made of oxygen resin, it has the advantages of large capacity, light weight, low equivalent resistance and self-healing. In order to test the quality of the dielectric film process of the molded solid tantalum capacitor and find out the cause of the failure, the solid tantalum capacitor must be unsealed. At this stage, the mechanical unpacking method or the wet etching method of a single chemical agent is generally used, which cannot guar...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a molded solid tantalum capacitor unsealing method, which combines wet etching method and mechanical method, solves the problem that the current mechanical unsealing method or single chemical reagent wet etching method cannot guarantee the integrity of the dielectric layer after unsealing sexual technical issues

Images