Unsealing method of molded solid tantalum capacitor

Abstract

The invention discloses an unsealing method for a molded solid tantalum capacitor. The molded solid tantalum capacitor to be unsealed comprises a tantalum core and an encapsulating material layer forencapsulating the tantalum core, the unsealing method comprises the following steps: removing an encapsulating material layer of the molded solid tantalum capacitor by adopting a corrosive reagent toexpose an internal tantalum core; removing the conductive connection layer and the cathode layer by adopting a reagent capable of generating a catalytic reaction with the cathode layer to expose the dielectric layer; cleaning the dielectric layer with an organic solvent; embedding the tantalum core exposed out of the dielectric layer along the section direction of the tantalum core by adopting embedding liquid; and grinding the inlaid tantalum core until the anode body, the dielectric layer and the interface layer of the anode body and the dielectric layer which need to be observed are exposed. The method has the beneficial effects that the molded solid tantalum capacitor is unsealed by adopting a method of combining wet etching and a mechanical method, so that the dielectric layer and theanode body in the tantalum capacitor can be completely observed after unsealing, and the inspection requirement of failure analysis is met.

Description

technical field [0001] The invention relates to the field of failure analysis of tantalum capacitors, in particular to a method for unsealing molded solid tantalum capacitors. Background technique [0002] Molded solid tantalum capacitors are made by sintering tantalum powder at high temperature to form an anode tantalum block with a porous structure, forming a dielectric layer of tantalum pentoxide on the surface of the tantalum, depositing manganese dioxide as the cathode outside the dielectric layer, and covering the outermost layer with a ring Made of epoxy resin, it has the advantages of large capacity, light weight, low equivalent resistance, and self-healing. In order to test the quality of the dielectric film process of molded solid tantalum capacitors and find out the cause of failure, the solid tantalum capacitors must be unsealed. At present, the mechanical unsealing method or the wet etching method of a single chemical reagent are generally used, which cannot gu...

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Problems solved by technology

[0003] The invention provides a molded solid tantalum capacitor unsealing method, which combines wet etching method and mechanical method, solves the problem that the current mechanical unsealing method or single chemical reagent wet etching method cannot guarantee the integrity of the dielectric layer after unsealing sexual technical issues

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