Hardware die with good heat-conduction effect

A mold and hardware technology, applied in the field of hardware molds, can solve problems such as poor thermal conductivity, and achieve the effects of increasing thermal conductivity, solving heat conduction problems, and reducing device temperature

Inactive Publication Date: 2020-11-17
赣州市典辰科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the patent of the present invention is to provide a metal mold with good heat conduction effect, which has the advantage of good heat conduction effect, and solves the problem of poor heat conduction effect of traditional hardware molds

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Hardware die with good heat-conduction effect
  • Hardware die with good heat-conduction effect
  • Hardware die with good heat-conduction effect

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The technical solutions in the patent embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the patent embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the patent of the present invention, rather than all the implementations. example. Based on the embodiments in the patent of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the patent of the present invention.

[0017] see Figure 1-3 , a metal mold with good thermal conductivity, including a lower mold base 1, the bottom of the lower mold base 1 is fixedly connected with a non-slip pad 20, and the bottom of the anti-slip pad 20 is provided with anti-skid patterns, through the setting of the anti-skid pad 20, can increase the lower mold The friction between the seat 1 and the conta...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a hardware die with a good heat-conduction effect. The hardware die comprises a lower die holder, the top of the lower die holder is fixedly connected with a lower die body, the top of the lower die body is provided with a lower die groove, the surface of the lower die body is provided with a super-heat-conduction aluminum oxide material, and the surface of the super-heat-conduction aluminum oxide material is provided with heat-conduction adhesive tape. A heat-conduction silicone grease material is arranged on the side, away from the super-heat-conduction aluminum oxidematerial, of the heat conduction adhesive tape. Through the arrangement of the super-heat-conduction aluminum oxide material, the heat-conduction adhesive tape, the heat-conduction silicone grease material, heat-conduction insulation elastic rubber, heat-conduction filling adhesive, a phase-change heat-conduction insulation material, a heat-conduction strip, heat-conduction columns, a heat-conduction silicone sheet, heat-conduction blocks and a uniform temperature plate, the heat-conduction problem of the hardware die can be solved, and meanwhile, the problem that a traditional hardware die is poor in heat-conduction effect is solved; and the hardware die with the good heat-conduction effect has the advantage of being good in heat-conduction effect and is worthy of popularization.

Description

technical field [0001] The patent of the present invention relates to the technical field of metal molds, in particular to a metal mold with good thermal conductivity. Background technique [0002] Metal molds are used in industrial production, using various presses and special tools mounted on the presses to make metal materials into parts or products of the desired shape through pressure. These special tools are collectively referred to as metal molds. Our daily production and life All kinds of tools and products used in the machine tool, ranging from the base of the machine tool, the shell of the fuselage, as small as a head screw, button and the shell of various household appliances, are all closely related to the mold, and the shape of the mold determines the shape of the mold. The shape of these products, the processing quality and precision of the molds also determine the quality of these products. Because of the different materials, appearance, specifications and use...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B30B15/02B30B15/34
CPCB30B15/02B30B15/34
Inventor 邓娟玲
Owner 赣州市典辰科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products