Electronic device heat dissipation structure with three-dimensional net-shaped structure and manufacturing method
A network structure and three-dimensional network technology are applied in the field of heat dissipation structure and manufacturing of electronic devices to achieve the effects of increasing critical heat flux density, promoting bubble nucleation, and increasing effective heat exchange area
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[0045] The present invention is described in further detail below:
[0046] A heat dissipation structure of an electronic device with a three-dimensional network structure, comprising a heat dissipation plate 1, a multi-layer micron-scale network structure, and a multi-layer skeleton. The cooling plate 1 is provided with a multi-layer micron-scale network structure, and the nano-scale microstructure is decorated on the multi-layer micron-scale network structure (put the heat dissipation structure of the electronic device with the three-dimensional network structure into the modification liquid, and the multi-layer micron-scale network structure Nanoscale microstructures are grown on the hierarchical network structure). Wherein, the heat dissipation plate 1 and the multi-layer micron-scale mesh structure are made of copper, which has good thermal conductivity. The length and width of the heat dissipation plate 1 are both L1, and the value is 5-50mm; the multilayer micron-scale...
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