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Thin-film lithium niobate-based heterogeneous integrated microwave photon transceiver chip

A technology integrating microwave and transceiver chips, applied in electromagnetic transceivers, optics, nonlinear optics, etc., can solve the problems of low reliability, high price, poor stability, etc., and achieve the effect of reducing interference and stability advantages

Active Publication Date: 2020-11-10
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the front-end is mainly composed of discrete devices and optical fibers, which is expensive, high power consumption, low reliability, poor stability, and difficult to meet the actual application requirements of the system

Method used

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  • Thin-film lithium niobate-based heterogeneous integrated microwave photon transceiver chip
  • Thin-film lithium niobate-based heterogeneous integrated microwave photon transceiver chip

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Embodiment

[0025] figure 1 It is a schematic diagram of the structural principle of the integrated microwave photon transceiver chip proposed by the present invention. As shown in the figure, the chip includes a radio frequency switch 1, a low noise amplifier circuit 2, a laser 3, an electro-optic modulator 4, an optical path switch 5, an optical delay Timer 6, integrated optical circuit 7, photodetector 8, high-power amplifier circuit 9 and microwave transmission line 10; each photonic device is connected through a thin film lithium niobate-based integrated optical circuit; each microwave device is connected through a microwave transmission line.

[0026] The chip includes a transmitting branch and a receiving branch. The receiving branch is composed of a low-noise amplifier circuit 2, a laser 3 and an electro-optic modulator 4. The transmitting branch is composed of a photodetector 8 and a high-power amplifier circuit 9; the receiving and transmitting work The state is switched by the ...

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PUM

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Abstract

The invention discloses a thin-film lithium niobate-based heterogeneous integrated microwave photon transceiver chip, which belongs to the technical field of integrated microwave photons and mainly comprises a radio frequency conversion switch, a low-noise amplifier circuit, a power amplifier circuit, a laser, an electro-optical modulator, a photoelectric detector, an optical path conversion switch and an optical delayer, heterogeneous integration of a radio frequency transmit-receive front end, electro-optic / photoelectric conversion and an optical delay chip is realized. Optical chips are connected through thin film lithium niobate-based optical waveguides, and three-dimensional heterogeneous integration is realized between an optical chips and a microwave chip through metal bump bonding,through hole interconnection and other processes. The chips can realize microwave transceiving and wave beam control functions based on a photon technology, has the advantages of miniaturization, high integration level, stable performance and the like, and meets the large-scale array application requirements of a transceiving front end of a microwave photon radar system.

Description

technical field [0001] The invention belongs to the field of integrated microwave photons, and in particular relates to a thin-film lithium niobate-based heterogeneous integrated microwave photon transceiver chip. Background technique [0002] "Microwave photonics" is an emerging interdisciplinary subject integrating microwave technology and photonic technology. It mainly uses the advantages of photonics such as large bandwidth, low loss and anti-electromagnetic interference to study how to use optoelectronic devices and methods to realize microwave / mm The generation, distribution, transmission, processing, and conversion of wave signals, etc., are too complex or impossible to achieve functions that rely solely on traditional microwave methods, and have important applications in many aspects such as optical communication, electronic warfare, radar, and aerospace integrated information systems. value. [0003] The transceiver component is the core component of the microwave ...

Claims

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Application Information

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IPC IPC(8): H04B10/40G02F1/03
CPCH04B10/40G02F1/0327G02F1/0305
Inventor 钱广孔月婵陈堂胜
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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