COB packaging process for MicroLED display screen

Abstract

The invention provides a COB packaging process for a MicroLED display screen, and relates to the technical field of COB packaging. The COB packaging process for the MicroLED display screen comprises the following steps: S1, cleaning: preparing a PCB, then dipping board washing water on wiping white cloth, and wiping the PCB from the middle to two sides; S2, wafer expanding: uniformly expanding thewhole LED wafer thin film by adopting an expanding machine, so that the LED crystal grains which are tightly arranged and attached to the surface of the thin film are pulled open; and S3, back gluing: dispensing a proper amount of silver paste on the PCB by adopting a dispensing machine. According to the invention, the COB integrated package can reduce the cost and simplify the manufacturing process of the LED screen; the thermal resistance of the chip can be reduced; high-density packaging is achieved, the heat dissipation area of a device is expanded to a certain extent by selecting the COBpackaged LED display screen, so that generated heat is diffused to the outside more easily, the cost is reduced, and compared with a traditional packaging mode, the packaging cost of the device can be saved in actual application of the LED display module.

Description

technical field [0001] The invention relates to the technical field of COB packaging, in particular to a COB packaging process for Micro LED display screens. Background technique [0002] Micro LED Display (Micro LED Display) is a new generation of display technology. Its LED structure is thinned, miniaturized and arrayed, making its volume about 1% of the size of mainstream LEDs. Each pixel can be addressed, Drive the light independently, reduce the pixel pitch from millimeter level to micron level, so that the theory can reach more than 1500ppi or even 2000ppi ultra-high resolution, Micro LED inherits LED low power consumption, high brightness, ultra-high resolution, color saturation, responsiveness It has the advantages of fast speed, super power saving, long life and high efficiency. [0003] As people's requirements for the resolution of indoor and outdoor LED displays are getting higher and higher, if the traditional SMD LED devices are still used for patch assembly o...

AI Technical Summary

Problems solved by technology

[0003] As people's requirements for the resolution of indoor and outdoor LED displays are getting higher and higher, if the traditional SMD LED devices are still used for patch assembly of LED displays, then on the one hand, because the LED display devices are getting smaller and smaller, the process difficulty is sharply increasing. increase, the yield rate is low, which leads to an increase in the cost of a single LED device; secondly, small-sized LED devices also require very high precision for placement equipment; third, the smaller the dot pitch of the LED display, the smaller the required placement LED devices increase geometrically, which greatly reduces the manufacturing efficiency of LED screens.