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Plating solution formula and process for vertical high-speed continuous tin plating

A high-speed plating, vertical technology, applied in the direction of plating tanks, electrodes, etc., can solve the problems of wire scratches, tin layer eccentricity, current density plating solution can not work normally, effectively and stably, etc.

Active Publication Date: 2020-10-27
烟台洛姆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims to solve the problem of appearance and performance defects caused by wire scratches and tin layer eccentricity caused by the increase of current density caused by the increase of current density after the speed-up of the tin-plated lead wire electroplating process, as well as the failure of the plating solution to work normally, effectively and stably, and the high-speed tin-plating process Provide a plating solution formula and process for vertical high-speed continuous tin plating

Method used

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  • Plating solution formula and process for vertical high-speed continuous tin plating
  • Plating solution formula and process for vertical high-speed continuous tin plating
  • Plating solution formula and process for vertical high-speed continuous tin plating

Examples

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Embodiment 1

[0051] The present embodiment relates to a kind of plating bath prescription of vertical high-speed tin plating, comprises each component of mass-volume concentration as follows: tin protosulfonate (sn 2+ ) 65g / L, combined additives 60g / L, phenolsulfonic acid 150g / L, 200g / L, 250g / L, 300g / L, 350g / L respectively.

[0052] The composition of described combination additive is: dispersant (polyethylene glycol) 2ml / L, anti-scorch agent 0.5ml / L, grain refiner (2-naphthol and others) 40mg / L, antioxidant: 0.2 g / L, flocculant: 0.1g / L, other auxiliary agents 1.0ml / L.

[0053] The dispersant is polyethylene glycol; the grain refiner is 2-naphthol; the antioxidant is sodium hypophosphite; the flocculant is polyacrylamide; Phenylenediamine or m-phenylenediamine; the other auxiliary agent can be, for example, an impurity-removing additive, and the impurity-removing additive is preferably ethylenediaminetetraacetic acid.

[0054] With the above plating solution formula, the tin plating oper...

Embodiment 2

[0059] The present embodiment relates to a kind of plating bath prescription of vertical high-speed tin plating, comprises each component of mass-volume concentration as follows: phenol sulfonic acid 250g / L, combined additive 60g / L, tin protophenol sulfonate (sn 2+ ) respectively take 20g / L, 40g / L, 60g / L, 80g / L, 100g / L.

[0060] The composition of described combination additive is: dispersant (polyethylene glycol) 2ml / L, anti-scorch agent 0.5ml / L, grain refiner (2-naphthol and others) 40mg / L, antioxidant: 0.2 g / L, flocculant: 0.1g / L, other auxiliary agents 1.0ml / L.

[0061] With the above plating solution formula, the tin plating operation is carried out under the conditions of temperature 50°C, stirring speed 200rpm, I=5A, and time 1min. The results of Hull Cell test pieces under different phenolsulfonic acid concentrations are as follows image 3 shown. Experiments have shown that increasing the Sn 2+ The concentration can broaden the range of current density, but Sn 2+ ...

Embodiment 3

[0063] The present embodiment relates to a kind of plating bath prescription of vertical high-speed tin plating, comprises each component of mass-volume concentration as follows: phenolsulfonic acid 250g / L, phenolsulfonic acid stannous (sn 2+ ) 75g / L, the combined additives are 40g / L, 60g / L and 80g / L respectively.

[0064] The composition of described combination additive is: dispersant (polyethylene glycol) 2ml / L, anti-scorch agent 0.5ml / L, grain refiner (2-naphthol and others) 40mg / L, antioxidant: 0.2 g / L, flocculant: 0.1g / L, other auxiliary agents 1.0ml / L.

[0065] With above-mentioned bath formula, carry out tinning operation under the condition of temperature 50 ℃, stirring speed 200rpm, I=5A, time 1min, the Hull Cell test piece result test piece under different phenolsulfonic acid concentration all agrees with image 3 The test piece is equivalent under the condition of 60g / L stannous phenolsulfonate.

[0066] Hull Cell shows that under the condition of high-speed tin ...

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Abstract

The invention discloses a plating solution formula and process for vertical high-speed continuous tin plating. The plating solution formula comprises the following components of 250 g / L-300 g / L of phenolsulfonic acid, 65 g / L-85 g / L of stannous phenolsulfonate and 40 g / L-80 g / L of a combined additive, and the temperature is 50 DEG C-60 DEG C. The improved formula of the process is adopted to replace a traditional sulfate process and a common phenolsulfonate process, the current density of the improved formula can be increased from 4-8 A / dm <2> to 10-30 A / dm <2>, the product density is good, andthe weldability and the temperature resistance both meet the requirements of national standards and industrial standards. A product produced by using the process provided has excellent heat resistance, and can tolerate a temperature range of 155-220 DEG C without discoloration.

Description

technical field [0001] The invention is applied in the field of production and manufacture of tin-plated leads for pins of electronic components, and in particular relates to a plating solution formula and process for vertical high-speed continuous tin plating. Background technique [0002] Tinned copper wires or tinned copper-clad steel wires are mostly used in electronic components such as varistors and thermistors. Copper wires or copper-clad steel wires are produced by continuous tinning. Although the process is relatively traditional, due to the dense crystallization of the coating, The thickness of the coating is uniform, continuous and controllable. It has been used as the mainstream production process for a long time, and it shows its technical advantages and irreplaceable characteristics. [0003] However, the traditional continuous electroplating tin plating process still has the following problems: [0004] ① The current density of tin plating is relatively low, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32C25D17/02C25D17/12C25D7/06
CPCC25D3/32C25D7/0607
Inventor 迟力夫王奎巩运许陈维厚
Owner 烟台洛姆电子有限公司
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