Magnetic spin Co-Cu valve and producing process thereof
A preparation process and magnetic spin technology, applied in the field of material engineering, can solve problems such as cumbersome process, not wide and flat steps, affecting the practical application of spin valves, etc., and achieve the effect of improving the sensitivity of the system
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[0009] The magnetic spin valve with Co / Cu / Co-CoO structure was prepared, the substrate was silicon wafer Si, the thickness of the bottom Co layer was kept at 2.0nm, the thickness of the middle layer Cu was 0.7nm, and the background vacuum during preparation was 4.6×10 -5 Pa, the Ar gas pressure during sputtering is 0.3 Pa. The Cu layer was obtained by DC sputtering with a sputtering current of 40mA. The Co magnetic layer was sputtered by radio frequency, and the sputtering power was 160W. The deposition rates of Co and Cu during the preparation were 0.08 and 0.1 nm / s, respectively. The thickness of the Co layer in the first half of the upper pinning layer Co-CoO is 1.0nm, which is obtained by ordinary radio frequency sputtering with a power of 160W, and the second half of CoO is 5:2 Ar and O 2 After the gas is mixed, it is prepared by reaction. After the completion, it is obtained by going out of the vacuum chamber and then oxidizing it with high-purity oxygen at 160 degrees...
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