LAP laser engraving process

Abstract

The invention discloses an LAP laser engraving process. The LAP laser engraving process comprises the following steps that S1, a plastic substrate is obtained; S2, an oxide film is plated on the surface of the substrate; S3, a circuit wiring channel is manufactured in the surface, plated with the oxidation film, of the substrate through laser; and S4, a metal layer is chemically plated in the circuit wiring channel on the substrate. The oxidation film is plated on the substrate to enhance the oxidation resistance and the wear resistance of the substrate before the circuit wiring channel is subjected to laser engraving on the plastic substrate, and the oxidation film can prevent the edge of the circuit wiring channel on the substrate from being burnt due to the heat of the laser when the circuit wiring channel is subjected to laser engraving on the substrate by the laser, so that the outline of the circuit wiring channel formed by laser is clear, meanwhile, interference of various factors in the chemical plating pretreatment process is avoided, the probability of undesirable phenomena such as overflow plating and skip plating of a product is greatly reduced, the product quality is improved, the quality of a finished product is ensured, and resource waste caused by defective products is reduced.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a LAP laser radium engraving process. Background technique [0002] With the development of mobile communication devices and smart wearable devices in the direction of miniaturization and intelligence, the antennas used in the above devices need to integrate a large number of functions such as WIFI and Bluetooth in an extremely limited space. [0003] LAP (Laser Activating Plating) technology is a laser-induced selective metal plating technology on ordinary plastic substrates. It can fabricate circuits and interconnection devices with electrical functions on any molding surface, so it has significant advantages in antenna manufacturing. [0004] In the conventional LAP process, due to the soft and fragile material of the ordinary plastic substrate, the product is easily burnt during the laser engraving process, resulting in a rough outline of the line and making the line of the ...

AI Technical Summary

Problems solved by technology

[0004] In the conventional LAP process, due to the soft and fragile material of the ordinary plastic substrate, the product is easily burnt during the laser engraving process, resulting in a rough outline of the line and making the line of the radium engraved layer unstable. The residual amount of potion on the rough outline of the line is relatively large, which leads to the corrosion of the line outline of the product, resulting in spots and micropores that affect the adhesion of the coating on the product, and then the product will have undesirable phenomena such as overflow plating and missing plating.

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