Reworking method for copper-clad plate circuit manufacturing abnormal products and printed circuit board

Abstract

The invention discloses a reworking method of copper-clad plate circuit manufacturing abnormal products. The reworking method comprises the following steps of acid pickling, film pasting, engineeringdata compensation adjustment, secondary alignment exposure, development, secondary etching, film stripping and inspection. The reworked abnormal product is a copper-clad plate subjected to one-time circuit manufacturing, oxides, oil stains, fingerprints and the like on the surface of the plate are removed in the acid pickling step, and the copper surface of the plate is roughened, so that subsequent copper plating of the copper surface is facilitated. In the step of engineering data compensation adjustment and the step of secondary alignment exposure, it is guaranteed that a short-circuit areacan be etched off through secondary etching, meanwhile, the problems of line negligence, sawteeth, steps and the like after secondary etching can be avoided, and the quality of plate reworking is improved. The invention further discloses a printed circuit board, the printed circuit board is manufactured by adopting the reworking method for manufacturing the abnormal product through the copper-clad plate circuit, recycling of the abnormal product is achieved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for reworking abnormal products made of copper-clad laminates and printed circuit boards. Background technique [0002] With the rapid development of social economy and the optimization and upgrading of economic structure, it means that a new round of technological revolution and industrial transformation in the world is emerging, which is bound to have a profound impact on the manufacturing industry worldwide. Printed circuit boards are the basic components of electronic equipment. , is the transmission carrier of current and signal, and plays a pivotal role in electronic equipment, so higher requirements are put forward for printed circuit boards. Under the traditional printed circuit board manufacturing process, defects such as short circuits often occur during the manufacturing process of copper clad laminates. These defects can be detected by AOI inspection, ma...

AI Technical Summary

Problems solved by technology

Under the traditional printed circuit board manufacturing process, defects such as short circuits often occur during the manufacturing process of copper clad laminates. These defects can be detected by AOI inspection, mainly because the local etching is not clean due to the uneven thickness of the copper layer of the board, or Vignettes appear during the exposure process, seriously affecting the yield of printed circuit boards, increasing the number of defective products, and increasing the cost of processing printed circuit boards

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