A method of manufacturing an ultra-precise circuit

A manufacturing method and ultra-precision technology, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, and chemical/electrolytic methods to remove conductive materials, etc., can solve problems such as inability to manufacture ultra-precision circuits, and achieve the effect of avoiding side erosion problems.

Active Publication Date: 2021-01-15
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the above-mentioned existing technical defects, the present invention provides a method for manufacturing an ultra-precise circuit, which can produce an ultra-precise circuit by combining negative and positive processes, and solves the problem that the conventional circuit process cannot be produced due to side erosion and side plating. Problems in making ultra-precise circuits

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The manufacturing method of a circuit board shown in this embodiment can be used to produce an ultra-precision circuit with a minimum line width and gap of 2 / 2mil (50 / 50 μm), which includes the following processing steps in sequence:

[0028] (1) Cutting: The core board is cut out according to the panel size of 520mm×620mm. The thickness of the core board is 0.35mm (excluding the thickness of the outer copper layer), and the thickness of the copper layer on both surfaces of the core board is 1OZ.

[0029] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit, and form the inner layer circuit pattern after development; inner layer etching, etch the inner layer ...

Embodiment 2

[0044] The manufacturing method of a circuit board shown in this embodiment can be used to produce an ultra-precision circuit with a minimum line width and gap of 2 / 2mil (50 / 50 μm), which includes the following processing steps in sequence:

[0045] (1) Cutting: The core board is cut out according to the panel size of 520mm×620mm. The thickness of the core board is 0.35mm (excluding the thickness of the outer copper layer). The thickness of the copper layer on both surfaces of the core board is 4-5μm, and the The thickness of the surface copper layer is smaller than the thickness of the copper layer of the circuit required by the design.

[0046] (2) Drilling: According to the existing drilling technology, according to the design requirements, the through holes used to conduct the upper and lower layers of the circuit are drilled on the core board, and the aperture of the through hole is pre-larged by 0.025 on the basis of the designed aperture. mm, to avoid the problem of sma...

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Abstract

The invention discloses a method for manufacturing an ultra-precise circuit, which comprises the following steps: manufacturing the outer layer circuit on the outer layer copper surface of the production board in a negative film process, and the thickness of the outer layer copper surface is smaller than the circuit copper required by the design layer thickness; then in the way of positive film technology, film is pasted on the production board, and after exposure and development in sequence, the outer layer circuit pattern is formed, so that the outer layer circuit made in step S1 is exposed; The thickness of the copper layer of the layer circuit is plated to the thickness required by the design, and finally the film is withdrawn. The method of the invention adopts the combination of negative film and positive film technology, can produce ultra-precise circuit, and solves the problem that conventional circuit technology cannot produce ultra-precise circuit due to side erosion and side electroplating.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing ultra-precise circuits. Background technique [0002] Printed circuit board (PCB) forms lines by coating dry film / wet film, exposure, development, electroplating, etching and other processes on a type of copper-clad core board, and forms between metallized holes and lines Electrical interconnection, which is the basic application principle of PCB. Conventional PCB circuit production can be divided into positive film method and negative film method according to different processes. The main differences are as follows: [0003] Positive film process: material cutting→inner layer→pressing→drilling→copper sinking→plate electricity→outer layer graphics→graphic plating→outer layer alkaline etching→post process; [0004] Negative film process: material cutting→inner layer→pressing→drilling→copper sinking→plate electricity→outer l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/46H05K3/42H05K3/00
CPCH05K3/0047H05K3/06H05K3/42H05K3/4611
Inventor 徐文中徐杰栋涂波胡志杨李江
Owner JIANGMEN SUNTAK CIRCUIT TECH
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