Calcium-aluminum-silicon-based ceramic material for high-density packaging and preparation method thereof

Abstract

The invention belongs to the technical field of electronic ceramic materials, particularly provides a calcium-aluminum-silicon-based ceramic material for high-density packaging and a preparation method thereof, and aims to solve the problem of thermal mismatch between a ceramic substrate and a PCB under high-density packaging. The calcium-aluminum-silicon-based ceramic material comprises the following components in percentage by weight: 4 to 15 percent of Al2O3, 2 to 10 percent of B2O3, 20 to 50 percent of CaO, 40 to 70 percent of SiO2 and 1 to 5 percent of CeO2. The calcium-aluminum-silicon-based ceramic material has stable and excellent performance, has a low dielectric constant and low dielectric loss, and is beneficial to efficient transmission of signals; due to high bending strength(158-205 MPa) and high Young's modulus (69-72 GPa), enough stable support protection is provided for the chip; the high thermal expansion coefficient (10.3-12.4 ppm / DEG C) and the PCB reach a proper matching degree, the thermal stress between materials is reduced, and the service life of the chip is prolonged; moreover, the substrate material is relatively low in preparation cost, relatively simple in process and stable in performance, and completely meets the requirement of high-density packaging.

Description

technical field [0001] The invention belongs to the technical field of electronic ceramic materials, in particular relates to ceramic materials with a high thermal expansion coefficient, and specifically provides a calcium-aluminum-silicon-based ceramic material for high-density packaging and a preparation method thereof. Background technique [0002] At present, ceramic packaging materials are mainly Al 2 o 3 , its advantages are good moisture resistance, high mechanical strength, high thermal conductivity, relatively mature production and processing technology. Ceramic ball grid array package structure (CBGA) is widely used in high-density packaging, but the thermal mismatch problem will occur when the ceramic package module is installed on the PCB through ball planting technology; therefore, a high thermal expansion coefficient, high bending strength and low Dielectric constant packaging materials, in order to meet the urgent needs of high-density packaging. [0003] I...

AI Technical Summary

Problems solved by technology

Ceramic ball grid array package structure (CBGA) is widely used in high-density packaging, but the thermal mismatch problem will occur when the ceramic package module is installed on the PCB through ball planting technology; therefore, a high thermal expansion coefficient, high bending strength and low Dielectric constant packaging materials, in order to meet the urgent needs of high-density packaging

[0003] In recent years, glass-ceramics has received extensive attention and research. For example, the magnesium-aluminum-silicon system has cordierite as the main crystal phase, and its thermal expansion coefficient is 2 o 3 The content of SiO is 95-96%. 2 The content of CaO is 0.6-1.5%, the content of CaO is 0.6-1.5%, the content of CoO is 0.5-1.5%, the dielectric constant of this material is 6-7, and the dielectric loss is ≤0.0003; Indicate the coefficient of thermal expansion and flexural strength, which are two important indicators to measure the thermal and mechanical properties of the substrate material; in addition, the melting temperature of the material reaches 1400-1600°C, which consumes a lot of energy during the preparation process and the production cost is high

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