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Chemical mechanical planarization equipment

A chemical mechanical and flattening technology, applied in metal processing equipment, grinding/polishing equipment, grinding racks, etc., can solve the problems of poor wafer surface uniformity, improve yield rate, uniform chemical reaction, avoid Effect of sudden changes in polishing rate

Pending Publication Date: 2020-09-04
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to solve the problem of poor uniformity of the wafer surface after the chemical mechanical planarization equipment in the prior art is polished, thereby providing a chemical mechanical planarization equipment that improves the uniformity of the wafer surface

Method used

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Embodiment Construction

[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention relates to the technical field of semiconductor equipment, in particular to chemical mechanical planarization equipment. When a wafer is in contact with a polishing pad, the wafer is provided with a contact area; the planarization equipment is provided with a liquid spraying assembly, and the liquid spraying assembly is provided with at least one liquid outlet; and liquid sprayed from the liquid outlet is uniformly distributed on the contact area. The invention provides chemical mechanical planarization equipment capable of improving the uniformity of the surface of the wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a chemical mechanical planarization equipment. Background technique [0002] With the development of Moore's Law, chemical mechanical planarization equipment plays an increasingly important role in the semiconductor manufacturing process, and the requirements for the process performance of the equipment are also getting higher and higher. In the process performance of chemical mechanical planarization, the most critical factor is the surface topography of the wafer. Whether the surface topography of the wafer is flat or not will directly affect the subsequent process and may affect the electrical performance of the final chip, so it can be effectively improved. Wafer surface topography is one of the most important targets for performance optimization of chemical mechanical planarization equipment. [0003] The existing chemical mechanical planarization equipment ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/34B24B53/017B24B41/02B24B57/02
CPCB24B37/10B24B57/02B24B53/017B24B41/02B24B37/34
Inventor 李婷岳爽尹影崔凯蒋锡兵靳阳
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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