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Beam shaping structure for improving laser cutting of flexible OLED module and method thereof

A laser cutting and beam shaping technology, used in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as affecting processing quality, reducing edge energy, and weakening the degree of haze, to ensure the effect of processing quality.

Inactive Publication Date: 2020-09-04
成都拓米电子装备制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After laser cutting, the front side of the product is as follows figure 1 As shown, from the perspective of the phenomenon, the middle part is completely cut, and the black part at the edge is Haze, and the degree of Haze gradually weakens from the middle position to the edge position. The reason for this phenomenon is that the Gaussian beam is used for cutting. The Gaussian beam is as follows figure 2 As shown, its energy is in a normal distribution. Observed from the focal cross section, the edge energy of the beam is significantly lower than the middle energy. Ideally, 1 / e2 is considered to be a processable area, and the energy distributed at the edge produces Haze during cutting. , which will affect the processing quality
[0003] At present, Gaussian beams are used for cutting in the industry. The working principle is: the laser used in laser cutting emits a Gaussian beam, and then uses a laser cutting lens to focus, and then cuts on the processing surface. After focusing, the beam is still Gaussian. The surface of the processed product produces a large range of Haze, which cannot be avoided, resulting in lower cutting quality

Method used

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  • Beam shaping structure for improving laser cutting of flexible OLED module and method thereof
  • Beam shaping structure for improving laser cutting of flexible OLED module and method thereof
  • Beam shaping structure for improving laser cutting of flexible OLED module and method thereof

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Embodiment 1

[0037] In this embodiment, a beam shaping structure is provided to improve the laser cutting of flexible OLED modules. The laser emits a Gaussian beam for shaping, and removes the energy distributed around the Gaussian spot. Use ZEMAX software to design and verify that the optical structure can be realized. Transformation of Gaussian beams. Its overall working principle is: the laser emits a Gaussian beam. After the Gaussian beam is converted by the optical composition I, the Gaussian beam is shaped to remove the energy of the edge, and then the laser cutting lens is used to focus, and then cut on the processing surface. A larger range of Haze will be generated on the surface of the processed product to reduce Haze.

[0038] Such as image 3 As shown, the optical configuration I includes: a first axicon lens and a second axicon lens arranged on the light propagation path from the incident light beam to the exit light beam, the first axicon lens and the second axicon lens form...

Embodiment 2

[0055] In this embodiment, another beam shaping structure is provided to improve the laser cutting of flexible OLED modules. The laser emits a Gaussian beam for shaping, removes the energy distributed around the Gaussian spot, uses ZEMAX software to design, and verifies that the optical structure can be Realize the transformation of Gaussian beam. Its overall working principle is: the laser emits a Gaussian beam. After the Gaussian beam is converted by the optical composition II, the Gaussian beam is shaped to remove the energy of the edge, and then the laser cutting lens is used to focus, and then cut on the processing surface. A larger range of Haze will be generated on the surface of the processed product to reduce Haze.

[0056] Such as Figure 4 As shown, the optical configuration II includes: a first conical reflector and a second conical reflector arranged on the light propagation path from the incident light beam to the outgoing light beam, the first conical reflector...

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Abstract

The invention discloses a beam shaping structure for improving laser cutting of a flexible OLED module and a method thereof, and belongs to the technical field of semiconductor laser cutting. A Gaussian beam is used as an incident light beam, and a first lens and a second lens are arranged on a ray propagation path of the incident light beam and an emergent light beam is formed; base angles of thefirst lens and the second lens relative to a ray propagation direction are selected according to processing requirements, and the two base angles are guaranteed to be opposite and are equal in absolute value; lens centers of the first lens and of the second lens are coincident with an optical axis of the light ray, and the size of an annular light spot of the emergent light beam is adjusted by adjusting spacing between the first lens and the second lens; and a laser cutting focusing lens is used for focusing the emergent light beam, the focused light spot is cut on a processing surface so asto shape the Gaussian beam, edge part energy is removed, and the purpose of processing quality is ensured by reducing generation of Haze.

Description

technical field [0001] The invention belongs to the technical field of semiconductor laser cutting, and in particular relates to an improved beam shaping structure and method for laser cutting of flexible OLED modules. Background technique [0002] In the field of OLED panel cutting, laser cutting is basically used at present. After laser cutting, the front side of the product is as follows figure 1 As shown, from the perspective of the phenomenon, the middle part is completely cut, and the black part at the edge is Haze, and the degree of Haze gradually weakens from the middle position to the edge position. The reason for this phenomenon is that the Gaussian beam is used for cutting. The Gaussian beam is as follows figure 2 As shown, its energy is in a normal distribution. Observed from the focal cross section, the edge energy of the beam is significantly lower than the middle energy. Ideally, 1 / e2 is considered to be a processable area, and the energy distributed at the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/062B23K26/38B23K26/70
CPCB23K26/06B23K26/38B23K26/062B23K26/70B23K26/702
Inventor 张满强金奉渊李琰肖瑶夏菁
Owner 成都拓米电子装备制造有限公司
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