Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board stripping waste liquid treatment method

A technology for printed circuit boards and stripping waste liquid, which is applied in the fields of metallurgical wastewater treatment, heating water/sewage treatment, neutralization water/sewage treatment, etc. Waste liquid treatment process and other issues, to achieve the effect of fast cooling and crystallization, conducive to subsequent separation operations, and fine particles

Active Publication Date: 2020-08-25
WUXI ZHONGTIAN SOLID WASTE DISPOSAL CO LTD
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] CN109052355A discloses a method for recycling phosphoric acid and acetic acid from waste aluminum etching solution. The method can effectively recycle phosphoric acid and acetic acid, but the etching solution mainly contains phosphoric acid, which is quite different from PCB deplating waste solution and cannot Applied to PCB deplating waste liquid treatment process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board stripping waste liquid treatment method
  • Printed circuit board stripping waste liquid treatment method
  • Printed circuit board stripping waste liquid treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] This embodiment provides a method for treating waste liquid deplating of printed circuit boards, the method comprising the following steps:

[0082] (1) Get 5L of the PCB deplating waste liquid of a certain electronics factory, wherein the nitric acid content is 12wt%, and the copper content is 6g / L, mix the waste liquid, negative pressure distillation under 120 ℃,-0.04MPa, divide in the distillation process Section detects the mass concentration of nitric acid in the nitric acid fraction, and supplements with water, concentrates to 500mL and when the mass concentration of nitric acid in the nitric acid fraction obtained by the last detection is 5wt%, stop the distillation to obtain a copper concentrate with a mass concentration of nitric acid of 4wt%. And the mass concentration of nitric acid is the nitric acid fraction of 10wt%, and the volume ratio of described waste liquid and total adding water is 2.58:1;

[0083] (2) Add 50 mL of tap water to the above-mentioned c...

Embodiment 2

[0088] This embodiment provides a method for treating waste liquid deplating of printed circuit boards, the method comprising the following steps:

[0089] (1) Take 5L of PCB deplating waste liquid from an electronics factory, wherein the nitric acid content is 20wt%, and the copper content is 10g / L, mix the waste liquid and water, and carry out negative pressure distillation at 118°C and -0.04MPa. Detect the mass concentration of nitric acid in the nitric acid fraction in the middle section, and add water, concentrate to 500mL and when the mass concentration of nitric acid in the nitric acid fraction obtained by the last detection is 4.5wt%, stop distillation, and the mass concentration of nitric acid obtained is 3wt%. The mass concentration of copper concentrated solution and nitric acid is the nitric acid fraction of 18wt%, and the volume ratio of described waste liquid and total water added is 3.25:1;

[0090] (2) Add 50ml of tap water to the above concentrated solution, a...

Embodiment 3

[0095] This embodiment provides a method for treating waste liquid deplating of printed circuit boards, the method comprising the following steps:

[0096](1) Take 5L of PCB deplating waste liquid from an electronics factory, wherein the nitric acid content is 10wt%, and the copper content is 5g / L, mix the waste liquid and water, and carry out negative pressure distillation at 115°C and -0.05MPa. Detect the mass concentration of nitric acid in the nitric acid fraction in the middle section, and add water, concentrate to 500mL and when the mass concentration of nitric acid in the nitric acid fraction obtained by the last detection is 5.5wt%, stop distillation, and the mass concentration of nitric acid obtained is 1wt%. The mass concentration of copper concentrated solution and nitric acid is the nitric acid fraction of 8wt%, and the volume ratio of described waste liquid and total water added is 2:1;

[0097] (2) Add 50ml of tap water to the above-mentioned concentrated solutio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a printed circuit board stripping waste liquid treatment method. The method comprises the following steps of: mixing waste liquid with water, and performing distilling; and separating nitric acid, and then carrying out post-treatment on a copper concentrated solution to prepare copper sulfate. With the method adopted, an alkali addition amount in a stripping waste liquid neutralization treatment process is greatly reduced, an organic solvent is not needed to add in the whole process, so that the post-treatment problem of the solvent can be avoided; nitrate and copper ions in stripping waste liquid can be recycled at the same time, resource utilization is realized, and the environmental pressure is relieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board waste liquid treatment, in particular to a method for treating printed circuit board waste liquid deplating. Background technique [0002] Printed circuit board (PCB) is one of the basic electronic component products. A large amount of microetching solution, etching solution, copper nitrate and other metals containing copper and other metals with different concentrations are produced in the production process of PCB industry. There will be a small amount of copper and heavy metals. If the environmental protection treatment cannot be carried out reasonably, on the one hand, it will cause a serious waste of resources; serious pollution and hazards to the health of the people. [0003] Among them, electroplating is an important production step in the PCB industry. In the electroplating process, since the hanger will be used repeatedly, the coating on the hanger must be deplated after ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C02F1/04C02F1/66C01G3/10C01D9/04
CPCC02F1/04C02F1/66C01G3/10C01D9/04C01P2006/80C02F2103/16
Inventor 孙垒垒孙志洋
Owner WUXI ZHONGTIAN SOLID WASTE DISPOSAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com