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Urea-based additive, its use and preparation method

An additive, urea-based technology, used in: urea-based additives, which can solve problems such as being unsuitable for current and future requirements of advanced printed circuit boards

Active Publication Date: 2022-07-12
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, when used in acidic copper electroplating baths, such additives are not suitable for meeting current and future requirements in the manufacture of advanced printed circuit boards, IC substrates and semiconductors, and metallization of glass substrates

Method used

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  • Urea-based additive, its use and preparation method
  • Urea-based additive, its use and preparation method
  • Urea-based additive, its use and preparation method

Examples

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[0385] Unless otherwise stated below, commercially available products were used as described in the technical data sheets available on the filing date of this specification. accelerator and Leveling agents are products available from Atotech Deutschland GmbH. Unless otherwise stated below, commercially available products were used as described in the technical data sheets available on the filing date of this specification.

[0386] Recorded at 400MHz with spectral shift 4300Hz, sweep width 9542Hz at 25°C 1 H-NMR spectroscopy (NMR spectrometer supplied by Bruker Corp.). Solvents used are d unless otherwise specified 6 -DMSO.

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Abstract

The present invention relates to a urea-based additive; a method for its preparation; the urea-based additive is advantageously used as an additive in a metal or metal alloy deposition composition, preferably a copper or copper alloy deposition composition, more preferably as Use of leveling agents and / or inhibitors therein; Metal or metal alloy deposition compositions comprising said urea-based additive and use of such compositions; Use of metal or metal alloy layers, preferably copper or copper alloys Methods of electrolytic deposition of layers on at least one surface of a substrate and metal or metal alloy layers formed from the above metal or metal alloy deposition compositions. For example, in the case of copper electroplating, especially when filling recesses, the urea-based additives allow for very flat copper deposits free of voids.

Description

technical field [0001] The present invention relates to: a urea-based additive; a method for its preparation; the urea-based additive is suitable as an additive in a metal or metal alloy deposition composition, preferably a copper or copper alloy deposition composition, more preferably as Use of inhibitors and / or levelling agents therein; metal or metal alloy deposition compositions comprising said urea-based additive and use of such compositions; use of metal or metal alloy layers, preferably copper or copper alloys A method of electrolytically depositing a layer on at least one surface of a substrate and a metal or metal alloy layer formed from the above metal or metal alloy deposition composition. Background technique [0002] Wet chemical deposition of metals and metal alloys (metal plating) is widely used in a variety of industries for the manufacture of decorative and functional coatings. Numerous metals and metal alloys can thus be formed on various substrates. Of p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/12C25D3/38C07C275/14C07C211/13C07C215/18C07C215/50C07C217/42C08G18/28C08G18/32C08G18/71C08G18/73
CPCC25D7/123C07C273/1827C07C275/10C07C275/14C07C211/13C07C215/18C07C215/50C07C217/42C08G18/712C08G18/73C08G18/2865C08G18/3228C25D3/38
Inventor O·博尔顿S·阿克曼J·阿道夫吴隽N·霍夫曼H·布伦纳
Owner ATOTECH DEUT GMBH
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