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Flexible lead frame preparation process capable of avoiding blind hole electroplating

A flexible lead and preparation process technology, applied in printed circuit manufacturing, circuits, printed circuits, etc., can solve the problems of difficult electroplating of pressure-welding holes of flexible lead frames, and achieve the effect of improving electroplating rate, high efficiency, and stable electroplating process.

Active Publication Date: 2022-05-13
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a flexible lead frame preparation process that avoids blind hole electroplating, convert blind hole electroplating into plane electroplating, and fundamentally solve the problem of difficult electroplating of flexible lead frame pressure welding holes. No missing plating occurs on the lead frame

Method used

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  • Flexible lead frame preparation process capable of avoiding blind hole electroplating

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Adopt technology of the present invention to prepare flexible lead frame, technological process is:

[0049] (1) Conduct electroplating on the back of the conductive metal layer first:

[0050] ① Dry film pressing for the first time: Use lamination equipment to attach photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 90°C, pressure 0.1Mpa, and speed 1m / min.

[0051] ②First exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 10mw / cm 2 , the exposure time is 10s.

[0052] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the welding hole, that is, the pos...

Embodiment 2

[0070] Adopt technology of the present invention to prepare flexible lead frame, technological process is:

[0071] (1) Conduct electroplating on the back of the conductive metal layer first:

[0072] ① Dry film pressing for the first time: Use film pressing equipment to attach photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 100°C, pressure 0.3Mpa, and speed 3m / min.

[0073] ②First exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 30mw / cm 2 , the exposure time is 5s.

[0074] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the welding hole, that is, the ...

Embodiment 3

[0092] Adopt technology of the present invention to prepare flexible lead frame, technological process is:

[0093] (1) Conduct electroplating on the back of the conductive metal layer first:

[0094] ① Dry film pressing for the first time: Use lamination equipment to attach photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 110°C, pressure 0.5Mpa, and speed 5m / min.

[0095] ②First exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 50mw / cm 2 , the exposure time is 1s.

[0096] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the welding hole, that is, the pos...

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Abstract

The invention belongs to the technical field of flexible lead frame preparation, and particularly relates to a flexible lead frame preparation process capable of avoiding blind hole electroplating. The technological process comprises the following steps of: electroplating the back surface of the conductive metal layer: performing the conductive metal layer, pressing a dry film for the first time, exposing for the first time, developing for the first time, plating a pressure welding surface and removing the film for the first time; electroplating the front surface of the conductive metal layer: punching the base material, pasting the conductive metal layer, baking, pressing the dry film for the second time, exposing for the second time, developing for the second time, etching, stripping the film for the second time, pressing the dry film for the third time, exposing for the third time, developing for the third time, plating a contact surface and stripping the film for the third time; wherein the plating pressure welding surface and the plating contact surface are plane electroplating. According to the method, blind hole electroplating is converted into plane electroplating, so that the problem that the pressure welding hole electroplating of the flexible lead frame is difficult is fundamentally solved, and the prepared flexible lead frame is free of skip plating.

Description

technical field [0001] The invention belongs to the technical field of preparation of flexible lead frames, and in particular relates to a preparation process of flexible lead frames which avoids blind hole electroplating. Background technique [0002] The flexible lead frame is mainly used in the field of electronic information technology and IC card packaging. As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. Therefore, flexible lead frames have strict requirements on quality. [0003] Generally used flexible lead frame...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D5/12C25D3/12C25D3/48H01L21/48H05K3/06H05K3/18
CPCC25D5/022C25D5/12C25D3/12C25D3/48H01L21/4821H05K3/061H05K3/188
Inventor 任志军邵汉文张成彬于艳邢树楠
Owner 新恒汇电子股份有限公司
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