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3D composite board and preparation method thereof

A composite plate and composite substrate technology, which is applied in chemical instruments and methods, synthetic resin layered products, metal material coating technology, etc., can solve the problems of 3D composite plates that cannot be mass-produced and yielded

Active Publication Date: 2020-08-21
WEIDALI IND CHIBI CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, the present invention provides a 3D composite board and its preparation method, which can reduce the phenomenon of cracks in the composite board during high-temperature molding on the basis of increasing the thickness of the color film, and solve many 3D problems with thick color films. Composite panels cannot be mass-produced or the yield rate is low. Improve the existing decoration process, and reduce costs and improve yield as much as possible under the condition of meeting the decoration requirements.

Method used

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  • 3D composite board and preparation method thereof
  • 3D composite board and preparation method thereof
  • 3D composite board and preparation method thereof

Examples

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preparation example Construction

[0041] A method for preparing a 3D composite plate, comprising the following steps:

[0042] Pretreatment of the composite substrate;

[0043] The method of electron beam evaporation is adopted, and the material with a refractive index of 2-3 and the material with a refractive index of 1.4-1.6 are respectively used as coating materials, and the coating is alternately performed on the composite substrate after pretreatment. The process of each coating The parameters include: the coating rate is

[0044] The coated composite substrate is subjected to high pressure or hot bending forming.

[0045] Specifically, the pre-treatment includes the steps of screen printing and UV (ultraviolet) transfer printing on the composite substrate. Before silk screen printing, the composite substrate can also be cleaned.

[0046]Preferably, the composite substrate is a PC / PMMA (polycarbonate / polymethyl methacrylate) composite board. Screen printing a layer of transparent / translucent ink on ...

Embodiment 1

[0069] This embodiment provides a method for preparing a 3D composite sheet, the preparation process of which is as follows figure 1 shown, including the following steps:

[0070] a. Clean the surface of the PC / PMMA composite board with a flat-panel cleaning agent for subsequent screen printing and UV transfer processing, and do not add chemicals during cleaning.

[0071] b. Screen-print a layer of transparent / translucent ink on the PC / PMMA composite board to make the product visually grainy and three-dimensional.

[0072] c. Apply a layer of UV transfer glue on the PC / PMMA composite board after step b, use a UV transfer machine to print the required texture or pattern on the surface of the glue, and then cure the glue through a UV furnace, and then Enter the coating process. In this step, the UV transfer glue adopts glue with fast curing, high bonding strength, good toughness, impact resistance, and excellent cold and heat resistance. The thickness of the texture or pattern...

Embodiment 2

[0080] This embodiment provides a method for preparing a 3D composite sheet, comprising the following steps:

[0081] a. Clean the surface of the PC / PMMA composite board with a flat-panel cleaning agent for subsequent screen printing and UV transfer processing, and do not add chemicals during cleaning.

[0082] b. Screen-print a layer of transparent / translucent ink on the PC / PMMA composite board to make the product visually grainy and three-dimensional.

[0083] c. Apply a layer of UV transfer glue on the PC / PMMA composite board after step b, use a UV transfer machine to print the required texture or pattern on the surface of the glue, and then cure the glue through a UV furnace, and then Enter the coating process. In this step, the UV transfer glue adopts glue with fast curing, high bonding strength, good toughness, impact resistance, and excellent cold and heat resistance. The thickness of the texture or pattern formed after the glue is cured is 10 μm.

[0084] d. After fo...

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Abstract

The invention relates to a 3D composite board and a preparation method thereof. The preparation method comprises the following steps: carrying out pretreatment on a composite substrate; conducting coating alternately on the pretreated composite substrate by using an electron beam evaporation method and taking a material with the refractive index being 2-3 and a material with the refractive index being 1.4-1.6 as coating materials, wherein the technological parameters of each time of coating include the coating rate which is 0.5-2.5 Angstroms / S; and conducting high pressure or hot bending forming on the coated composite substrate. According to the method, on the basis that the thickness of a color film layer is increased, the phenomenon that cracks occur to the composite board in the high-temperature forming process can be reduced, and the problem that a large number of 3D composite boards with thick color film layers cannot be produced in batch or the yield is low is solved.

Description

technical field [0001] The invention relates to the technical field of curved cover plates, in particular to 3D composite plates and a preparation method thereof. Background technique [0002] With the development of 5G communication and wireless charging technology, the development momentum of electronic products is rapid, especially electronic products with curved screens are favored by more people. Among them, the good arc grip of 3D cover boards has gradually replaced 2.5D cover boards. At present, some manufacturers use 3D glass as electronic products, especially as the cover of mobile phones. However, the cost of 3D glass is too high to meet the market demand. 3D composite sheet can be made to be exactly the same as 3D glass in appearance (visual), therefore, using composite sheet to make 3D cover has become a research hotspot in this field. [0003] At present, in the process of 3D cover plate made of composite plate, there are mainly the following two methods: one o...

Claims

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Application Information

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IPC IPC(8): B32B27/36B32B27/30B32B27/08B32B33/00C23C14/30C23C14/08C23C14/10
CPCB32B27/365B32B27/308B32B27/08B32B33/00C23C14/30C23C14/08C23C14/10C23C14/083C23C14/081
Inventor 曹欢笑刘保磊王稳祁立坡金迪
Owner WEIDALI IND CHIBI CO LTD
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