Electrostatic flash micro-spray circulation cooling system for high-power chip heat dissipation

Abstract

The invention relates to an electrostatic flash micro-spray circulating cooling system for heat dissipation of high-power chips, which includes a spray chamber, a charging chamber and a cooling medium refrigeration circulation pipeline mechanism; through the cooling medium refrigeration circulation pipeline mechanism, the liquid The cooling medium is sent into the charging chamber, and the charged droplets obtained through the charging chamber can enter the micro-channel nozzles of the spray chamber, so that the charged droplets can be deposited on the target surface under the action of the spray droplet electric field through the micro-channel nozzles. The surface of the heat sink, the cooling medium after cooling the heat sink is returned to the cooling medium refrigeration cycle pipeline mechanism, so that the current temperature of the heat sink collected by the heat sink temperature sensor is consistent with the preset target temperature in the circulating cooling controller consistent. The invention can effectively solve the high-efficiency heat dissipation of high-power chips, improve cooling efficiency, reduce system volume, and meet the technical requirements for miniaturization, integration and high reliability of cooling systems in the fields of national defense and aerospace.

Description

technical field [0001] The invention relates to a circulating cooling system, in particular to an electrostatic flash micro-spray circulating cooling system used for heat dissipation of high-power chips, and belongs to the technical field of chip heat dissipation. Background technique [0002] Electronic devices of high-power chips are widely used in aerospace, national defense, industrial and agricultural production, and biomedical fields due to their advantages of long life, high reliability, small size, and light weight. With the continuous improvement of chip power density, the continuous reduction of heat dissipation area, and the special application requirements of miniaturization, integration and light weight in the aerospace field, the power density of high-power chips has exceeded 500 W / cm 2 , which is equivalent to the heat generated by friction between the aircraft and the high-speed airflow when it returns to the atmosphere. The famous 10 ºC rule points out that...

AI Technical Summary

Problems solved by technology

[0005] Refrigerant flash spray cooling ability is strong, which is expected to solve the heat dissipation problem of high-power chips. However, due to the flash evaporation, bubbles are often generated inside and on the surface of the refrigerant. The bursting of the bubbles leads to explosive fragmentation of the refrigerant. Spray cone angle (> 90º), it is difficult to implement precise cooling for high-power semiconductor chips with a heat dissipation area of ​​only tens of square millimeters, and a large amount of working fluid is deposited or splashed outside the heat dissipation surface, which easily leads to a decrease in cooling efficiency and energy waste

In addition, in order to obtain better atomization and cooling effects, the spray distance is often set to more than 30 mm, resulting in a bulky spray chamber, making it difficult to realize miniaturized and integrated cooling system design and packaging

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