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Packaging component of semiconductor tube core and preparation method thereof

A technology of semiconductor tubes and packaging components, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as susceptibility to cancer and affecting communication quality, and achieve good sealing effect and excellent preparation process Simple, excellent effect of electromagnetic shielding performance

Active Publication Date: 2020-08-07
广州市锐骏半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] 3C products such as notebook computers, GPS, ADSL and mobile phones will generate noise due to high-frequency electromagnetic wave interference, which will affect the communication quality
In addition, if the human body is exposed to strong electromagnetic fields for a long time, it may be susceptible to cancer

Method used

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  • Packaging component of semiconductor tube core and preparation method thereof

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Embodiment Construction

[0026] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the Authorized Specification. In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other examples of the exemplary embodiment may have different va...

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Abstract

The invention provides a packaging component of a semiconductor tube core and a preparation method of the packaging component. The method comprises the following steps: setting the semiconductor tubecore on a circuit substrate, etching the peripheral edge of the semiconductor tube core such that the side surfaces around the semiconductor tube core are inclined side surfaces, sequentially forminga first polyvinyl alcohol layer, a first silver nanowire layer, a second polyvinyl alcohol layer, a second silver nanowire layer, a third polyvinyl alcohol layer and a third silver nanowire layer on the semiconductor tube core, then forming a molding layer, forming a conductive structure in the molding layer, enabling the distance between the conductive structure and the edge of a lower surface ofthe semiconductor tube core to be smaller than 5 microns, enabling the conductive structure to be electrically connected with the circuit substrate, and then performing a cutting process to form thepackaging component of the semiconductor tube core.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging component of a semiconductor die and a preparation method thereof. Background technique [0002] 3C products such as notebook computers, GPS, ADSL, and mobile phones will generate noise due to high-frequency electromagnetic wave interference, which will affect the communication quality. In addition, if the human body is exposed to strong electromagnetic fields for a long time, it may be susceptible to cancer. Therefore, anti-electromagnetic interference is a necessary and imperative process. In the existing anti-electromagnetic interference preparation process, a conductive coating is usually wrapped on the outside of the packaging structure. The conductive coating material is silver, tin, copper, zinc or other metal materials and alloys, or other conductive coatings such as conductive resin. coating. How to improve the preparation process for preventing elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L23/31H01L23/552
CPCH01L21/50H01L21/56H01L23/3114H01L23/552
Inventor 侯新飞
Owner 广州市锐骏半导体有限公司
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