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Metal-based printed circuit board

A printed circuit board, metal-based technology, used in printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problem that the thermal conductivity of the insulating layer cannot effectively utilize the heat dissipation capacity of the metal-based electronic components, and achieve accelerated heat dissipation. The rate of heat dissipation, the effect of accelerating heat exchange and enhancing heat dissipation capacity

Inactive Publication Date: 2020-07-31
合肥科塑信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to make up for the deficiencies of the existing technology and solve the problem in the prior art that the metal-based printed circuit board cannot effectively utilize the heat dissipation capacity of the metal base due to the influence of the thermal conductivity of the insulating layer to quickly diffuse the heat generated by the electronic components in the air, this paper A metal-based printed circuit board proposed by the invention

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0034] The preparation method of the metal-based printed circuit board comprises the following steps:

[0035] S1: melting the metal aluminum ingot and pouring it into a mold to prepare the aluminum-based metal base 1, and polishing the surface of the metal base 1 to remove the oxidized part of the metal base 1 surface, and performing anodic oxidation treatment on the surface of the metal base 1 after polishing, Make the metal base layer 1 form a dense oxide film; polish the surface of the metal base layer 1 to remove the aluminum oxide film layer naturally formed on the surface, and form a relatively dense oxide film layer through anodic oxidation, so that the formed aluminum oxide film structure is more compact It is denser and smoother. At the same time, the use of anodic oxidation treatment can also make the formed aluminum oxide film itself have strong adsorption performance, so that the metal base layer 1 and the insulating layer 2 resin are more closely combined, effecti...

Embodiment approach

[0043]As an embodiment of the present invention, an elastic sheet 17 is fixedly connected to the side of the deformation sheet 16 away from the heat dissipation pad 13; the elastic sheet 17 is made of a thermal bimetallic material with a high thermal expansion coefficient. The side is close to the deformation sheet 16; when working, the temperature of the deformation sheet 16 rises, thereby causing bending, so that the heat sink 15 and the heat dissipation pad 13 are separated, thereby increasing the heat dissipation area, and at the same time, the elastic sheet 17 and the deformation sheet 16 are fixed to each other. Even, when the deformation sheet 16 heats up, the elastic sheet 17 is also deformed. At this time, the force of the deformation of the elastic itself matches the bending force of the deformation sheet 16 to form a squeeze on the side of the heat sink 15 away from the heat dissipation pad 13, so that the surface of the heat sink 15 Regular protrusions are formed to...

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Abstract

The invention belongs to the technical field of printed circuit board preparation, and particularly relates to a metal-based printed circuit board, which is characterized in that uniformly distributedmounting holes are formed in one side, close to an insulating layer, of a metal base layer; the mounting hole is designed in a step shape; the metal base layer is fixedly connected with a heat conduction column through the mounting hole; the heat conduction column is made of beryllium oxide ceramic materials; the heat conduction column penetrates through the insulating layer; the end, close to the copper-clad layer, of the heat conduction column is designed to be in a T shape; a conduction hole is formed in the heat conduction column; the via holes are formed in the horizontal direction; theconducting holes are filled with heat conducting wires; the heat conduction wire is made of a heat conduction silica gel material; and the through holes are formed in the two ends of the heat conduction column; the heat conduction columns made of the beryllium oxide ceramic material and arranged in the insulating layer have high heat conduction performance, so that heat is rapidly conducted by theheat conduction columns and transmitted to the metal base layer, the metal base layer is used for dissipating the heat, and the transverse heat dissipation capacity of the printed circuit board is achieved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board preparation, in particular to a metal-based printed circuit board. Background technique [0002] Printed circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components, and its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, which improves the automation level and production labor rate. The metal-based printed circuit board is mainly composed of a metal base layer, an insulating layer and a copper clad layer. Since the printed circuit board is mainly used to provide power lines and support platforms for welding electronic components , when the electronic components work on the printed circuit board, some electronic components will dissipate a large amount of heat, thus putting forward certain req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/38H05K3/06
CPCH05K1/0209H05K1/021H05K3/065H05K3/381H05K3/386
Inventor 林胜男陈伟光周浩
Owner 合肥科塑信息科技有限公司
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