Composite semiconductor material

A compound semiconductor and semiconductor technology, applied in the field of air purification, can solve the problems of unsatisfactory purification efficiency, easy to be oxidized and corroded, high production cost, etc., achieve good chemical stability, not easy to generate ozone, and easy to process and produce

Active Publication Date: 2020-07-14
BEIJING HUAQING CAIR AIR CLEANING TECH CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a compound semiconductor material, which can replace the metal plate material of the existing purification unit, and overcome the poor safety, high ozone level, unsatisfactory purification efficiency, easy oxidation and corrosion, and production of the traditional metal body as the purification unit. Disadvantages such as high cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite semiconductor material
  • Composite semiconductor material
  • Composite semiconductor material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The principle and spirit of the present invention will be described below with reference to several exemplary embodiments shown in the accompanying drawings. It should be understood that these implementations are described only to enable those skilled in the art to better understand and implement the present invention, but not to limit the scope of the present invention in any way.

[0032] Please refer to Figure 1-4 , a compound semiconductor material provided by an embodiment of the present invention is in the form of a strip, and the strip can form a purification unit with a filtering function in a certain manner. For example, the strip-shaped body can form a disc-shaped purification unit in the form of winding, and there are gaps for gas to flow between the strip-shaped body and the strip-shaped body in the disc-shaped purification unit. When the air flows through the purification unit along the vertical direction of the disc surface of the disc structure, the air...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
densityaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a composite semiconductor material which comprises a base material made of a semiconductor flame-retardant high polymer material, and a conductive material is arranged in the base material. The material replaces a metal pole plate material of an existing purification unit, and the defects that a traditional metal body is poor in safety, high in ozone amount, not ideal in purification efficiency, prone to oxidation corrosion, high in production cost and the like when used as the purification unit are overcome. The composite semiconductor material can be widely applied tothe fields of heating ventilation air conditioning and air purification, and has the advantages of simple structure, good safety, high purification efficiency, good chemical stability, good structural strength, good flame retardancy, good temperature resistance, good corrosion resistance, good oxidation resistance, good wear resistance, good piezoelectricity and other special performances.

Description

technical field [0001] The invention relates to the technical field of air purification, in particular to a compound semiconductor material which can be applied to a purification unit for removing particulate matter in the air. Background technique [0002] Semiconductor material (semiconductor material) is a class of semiconducting properties, the conductivity is between conductors and insulators, and the resistivity is in the range of about 1mΩ·cm to 1GΩ·cm. [0003] Flame-retardant polymer materials refer to polymer materials that do not burn when exposed to flames, or are not easy to burn, and extinguish quickly after leaving the flame. Polymer materials, also known as polymer materials, are materials composed of polymer compounds as the matrix and other additives (auxiliary agents). One type of polymer material itself has a flame-retardant structure, such as polyvinyl chloride, polyvinylidene chloride, polyvinylidene fluoride, fluorine-containing plastics, etc.; the ot...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/30B32B27/36B32B27/32B32B27/42B32B27/34B32B27/08B32B27/06B32B9/00B32B9/04B32B3/08B03C3/40
CPCB03C3/40B32B3/085B32B9/007B32B9/045B32B27/08B32B27/304B32B27/32B32B27/34B32B27/36B32B27/42B32B2307/202B32B2307/306B32B2307/3065B32B2307/554B32B2307/714
Inventor 尤晶尤龙飞孟山青李洪喜吴红文王霜王蕾刘纯鑫孙中仪
Owner BEIJING HUAQING CAIR AIR CLEANING TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap