COB camera module and packaging method thereof

Abstract

The invention discloses a COB camera module and a packaging method thereof. The voice coil motor comprises a circuit board, a chip attached to the circuit board, a light filtering assembly attached tothe chip, a motor and a lens locked inside the motor, the motor is glued to the light filtering assembly, the locking height of the lens on the motor is h1, and the distance between the voice coil motor and the light filtering assembly is h2. The camera module is packaged by adopting two specific sizes of h1 and h2, and is matched with compensation type optical axis correction, so that the automatic focusing accuracy of the camera module and the optical axis overlap ratio between modules can be improved to the greatest extent. The automatic focusing accuracy of the COB camera module is improved by adopting two specific sizes of h1 and h2; defective products are accurately discriminated through compensation type optical axis correction, and meanwhile, the fault tolerance of optical axis correction is improved, so that the yield is improved; grading of the COB camera module can be completed in the packaging process through primary optical axis correction and compensation type secondarycorrection of the camera active focusing equipment.

Description

technical field [0001] The invention relates to the technical field of camera manufacturing, in particular to a COB camera module and a packaging method thereof. Background technique [0002] There are two packaging modes for traditional camera modules: COB (Chip On Board) and CSP (Chip Scale Package). The advantage of CSP packaging is that the packaging section is completed by the front-end process, and the chips in CSP packaging have lower requirements for cleanliness, better yield rate, low cost of process equipment, and short process time because of the glass covering. Poor transmittance, more expensive, higher height, backlight penetration ghost phenomenon. COB packaging has the advantages of better image quality, lower packaging cost, and lower module height. In addition, major brand manufacturers gradually require module manufacturers to assemble and ship products using the COB process. In the future, the COB process will become the mobile phone camera module A tren...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the shortcomings of the above-mentioned optical axis correction method, the present invention provides a COB camera module packaging method, which solves the problem of optical axis deviation that occurs with the stacking of components in the prior art, and adopts modular camera module packaging method, and through the primary correction and secondary compensation correction of the optical axis within the allowable range of error, it can accurately identify defective products and effectively improve the yield rate of COB camera modules, and reduce production costs while improving autofocus accuracy ,Increase productivity

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