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Water-soluble mold material for resin-based composite material

A technology of mold materials and composite materials, applied in the direction of manufacturing tools, ceramic molding machines, etc., can solve the problems of poor high temperature resistance and achieve good high temperature resistance.

Active Publication Date: 2020-06-26
JINGGANGSHAN UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a water-soluble mold material for resin-based composite materials and a method for making a water-soluble mold, so as to solve the problem of poor high temperature resistance in existing water-soluble molds (core molds) for resin-based composite materials

Method used

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  • Water-soluble mold material for resin-based composite material
  • Water-soluble mold material for resin-based composite material
  • Water-soluble mold material for resin-based composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation method of the mold is:

[0022] Ingredients: Dissolve the ceramic precursor whose main chain is the organosilicon structure in water to make an aqueous solution with a concentration of 20%, add water-soluble mold fillers, and the quality of the water-soluble ceramic precursors is 8% %, stir evenly to make water-soluble mold material;

[0023] The filler is: ordinary sand

[0024] Preforming: putting the water-soluble mold material obtained in step (1) into a mold for making a water-soluble mold or core mold and compacting to obtain the desired shape of the water-soluble mold;

[0025] Drying: drying the preformed water-soluble mold obtained in step (2) at a drying temperature of 150° C. until the preformed water-soluble mold is dried to form a molded water-soluble mold; machining: drying the dried The surface of the preformed water-soluble mold is machined to obtain a water-soluble mold;

[0026] Surface treatment: Coating a layer of ceramic precursor...

Embodiment 2

[0030] The water-soluble mold filler described in this embodiment is one or more mixtures of micron-sized silica, micron-sized alumina and micron-sized titania hollow ceramic microspheres. Other compositions are the same as in Embodiment 1.

Embodiment 3

[0032] The water-soluble mold filler described in this embodiment is composed of any two or more of micron-sized silica, micron-sized aluminum oxide and micron-sized titania hollow ceramic microspheres uniformly mixed in any ratio.

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Abstract

The invention provides a water-soluble mold material for a resin-based composite material, relates to a manufacturing method for the water-soluble mold material for the resin-based composite material,and belongs to the field of new materials. The water-soluble mold material is composed of water-soluble ceramic precursor water solution and filler for a water-soluble mold, wherein the mass percentage concentration of the water-soluble ceramic precursor water solution is 10 %-30 %, and the solute mass of the ceramic precursor water solution is 1 %-15 % of the mass of the filler for the water-soluble mold. According to the water-soluble mold material, the adopted water-soluble ceramic precursor is a substance with good thermal stability, can still be dissolved after being heated to 800 DEG C,has good high temperature resistance, and is suitable for forming the resin-based composite material with high curing temperature.

Description

technical field [0001] The invention relates to a method for manufacturing a water-soluble mold material of a resin-based composite material, which belongs to the field of new materials. Background technique [0002] The adhesives used for traditional water-soluble materials include inorganic salts and water-soluble polymers. The salt core (mandrel) made of the above materials not only has strong hygroscopicity, poor core surface quality, but also difficult to guarantee dimensional accuracy. Water-soluble polymers are polymer compounds with hydrophilic groups. The water-soluble mold material often used in resin-based composites is polyvinyl alcohol. Although it is easy to shape, it has a low glass transition temperature and poor thermal stability. When the temperature exceeds 150°C, the polyvinyl alcohol will turn black and sinter, so it is difficult to completely clean the mold material when demoulding. For the molding process of composite materials with high curing temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B3/00B28B11/24B28B11/04B29C33/38C04B26/32C04B41/64C04B26/30
CPCB28B3/00B28B11/243B28B11/04B29C33/3842C04B26/32C04B41/64C04B41/009C04B41/4905C04B26/30C04B2201/50C04B14/06C04B41/4539C04B14/303C04B14/305
Inventor 李晓丹隋岩王冠辉肖琳刘诚王玮丁超
Owner JINGGANGSHAN UNIVERSITY
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