A kind of substrate for micro-led display panel and manufacturing method thereof

Abstract

The present application relates to a substrate for a micro-LED display panel and a manufacturing method thereof. The substrate includes: a glass substrate; a first metal strip extending along a first side of a first surface of the glass substrate; The second metal strip extending from the second side corresponding to the first side of the second surface of the substrate; the bottom surfaces of the first metal strip and the second metal strip are in contact with each other, so that the first metal strip and the second metal strip A structure in which parts of the metal on the first surface and the second surface of the glass substrate are connected through the metal on the side of the glass substrate. Adopting the substrate structure and manufacturing method of the present invention solves the phenomenon that the side lines are easy to break and lack glue when mobile printing is used; The difficulty of patterning with glue on the side, the metal will not fall off and the accuracy of the pattern is guaranteed.

Description

Technical field [0001] The present application relates to the present invention relates to the field of display, and in particular, to the field of micro LED display in the field, more specifically a side metal structure and method for micro LED display. Background technique [0002] The micro-LED display panel has ultra-high pixels, ultra-high resolution, characteristics of low, long life, technology, micro-zone, and tiny-size LED array, which power consumption is small, with Compared to the OLD, the distance between the pixels can be lowered from the MM to the UM, the color gamut is high, and the prior art is produced by microfum-emitting diode arrays, and the light-emitting diode naked chip is separated from the sapphire substrate by laser stripping technology. After the opening, the light-emitting diode naked chip is adsorbed from the supply substrate from the supply substrate using a patterned transfer substrate, and the receiving substrate is a silicon substrate that has be...

AI Technical Summary

Problems solved by technology

In an existing technology of super-large display through splicing, in order to achieve a very difficult seamless splicing, it is necessary to use glass front and back technology, and perform a through-hole process on the glass to realize the front and second surface circuit lines connection, but there are certain problems in the current method of metal plating in through holes, because in the subsequent process, the thermal expansion coefficients of metal and glass are different, causing the metal to easily expand and fall off from the hole in the subsequent high temperature process

In another prior art, the splicing method used is to use a flexible FPC to connect the upper and lower circuits. Although the connection can be realized, but because the thickness of the FPC is relatively large, the splicing seam caused by the splicing screen is extremely large, which affects the display. Effects and overall look

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