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Silver-plated superfine copper wire and preparation method thereof

A silver-plated copper wire and copper wire technology, which is applied in the direction of cable/conductor manufacturing, conductive materials, metal/alloy conductors, etc., can solve problems such as broken wires, limited tension resistance, and small specifications of ultra-fine copper wires, etc., to achieve application Good prospects, easy to solve the problem of disconnection, simple preparation method

Active Publication Date: 2018-06-29
安徽晋源铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, ultra-fine copper wires are all produced by stretching method, but due to the small size of ultra-fine copper wires, the tensile force they can withstand is very limited, and it is easy to break during the stretching process, resulting in low yield and difficult processing technology.

Method used

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Examples

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Comparison scheme
Effect test

Embodiment 1

[0023] The present invention proposes a silver-plated ultra-fine copper wire, the silver-plated ultra-fine copper wire has a diameter of 0.02 millimeters, including copper alloy and copper alloy surface plating to form a 0.3 micron silver layer, and the copper alloy raw materials include: Pr 0.008wt%, Ni0.006wt%, Sn 0.004wt%, B 0.005wt%, Pd 0.005wt%, and the balance is Cu with a purity not less than 99.9999%.

Embodiment 2

[0025] The present invention proposes a silver-plated ultra-fine copper wire, the silver-plated ultra-fine copper wire has a diameter of 0.05 millimeters, including copper alloy and copper alloy surface plating to form a 0.8 micron silver layer, and the copper alloy raw materials include: Pr 0.01wt%, Ni0.009wt%, Sn 0.008wt%, B 0.008wt%, Pd 0.008wt%, and the balance is Cu with a purity not less than 99.9999%.

Embodiment 3

[0027] The present invention proposes a silver-plated ultra-fine copper wire, the silver-plated ultra-fine copper wire has a diameter of 0.03 millimeters, including copper alloy and copper alloy surface plating to form a 0.5 micron silver layer, and the copper alloy raw materials include: Pr 0.009wt%, Ni0.007wt%, Sn 0.005wt%, B 0.006wt%, Pd 0.006wt%, and the balance is Cu with a purity not less than 99.9999%.

[0028] The preparation method of the above-mentioned silver-plated ultra-fine copper wire that the present invention also proposes comprises the steps:

[0029] S1. Mix Pr, Ni, Sn, B, Pd and Cu according to the percentage by weight, add them into a smelting furnace with a temperature of 1390 ° C, vacuum smelt for 35 minutes, and make an oxygen-free copper rod with a diameter of 8 mm through continuous casting;

[0030] S2. Put the S1 oxygen-free copper rod into the drawing machine, roughly draw it into a copper wire with a diameter of 1.5 mm at a speed of 260 m / min, and...

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Abstract

The invention discloses a silver-plated superfine copper wire. The diameter of the silver-plated superfine copper wire is 0.02-0.05mm. The silver-plated superfine copper wire comprises a copper alloyand a 0.3-0.8 micron silver layer coating the surface of the copper alloy, wherein the copper alloy comprises the following raw materials in percentage by weight: Pr, Ni, Sn, B, Pd and Cu. The invention also discloses a preparation method of the silver-plated superfine copper wire. The preparation method comprises the following steps: mixing Pr, Ni, Sn, B, Pd and Cu in percentage by weight, addingthe mixture into a smelting furnace to be smelted in vacuum, and carrying out continuous casting to prepare an oxygen-free copper bar, the diameter of which is 6-10mm; roughly drawing and annealing the oxygen-free copper bar to prepare a rough copper wire, the diameter of which is 1.0-2.0mm; coating a silver layer to the surface of the rough copper wire to prepare a silver-plated copper wire; lubricating the surface of the silver-plated copper wire to obtain a lubricated copper wire; and finely drawing and annealing the lubricated copper wire to prepare the silver-plated superfine copper wire. The silver-plated superfine copper wire prepared is excellent in performance, simple and efficient in preparation method and good in application prospect.

Description

technical field [0001] The invention relates to the technical field of copper material processing, in particular to a silver-plated ultra-fine copper wire and a preparation method thereof. Background technique [0002] In the field of copper processing technology, it is generally defined that copper wires with a diameter of no more than 0.05 mm are called ultra-fine copper wires. Ultra-fine copper wires are widely used in packaging wires for the back-end packaging process of integrated circuits, micro-motors, high-frequency ultra-fine coaxial wires connected to the motherboard, cables for high-speed broadband transmission, high-speed transmission lines for computer peripheral systems, and biochemical and medical fine wires. in the wire. At present, with the rapid development of the electronic information industry, especially the rapid development of notebook computers, mobile communication products and terminal signal transmission products, the demand for ultra-fine copper ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/02H01B1/02H01B13/00B21C9/02B21C37/04
CPCB21C9/02B21C37/042H01B1/026H01B5/02H01B13/00
Inventor 潘加明
Owner 安徽晋源铜业有限公司
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