Transparent polyimide film and preparation method thereof

A technology of polyimide film and transparent polyimide, applied in the field of transparent polyimide film and its preparation, can solve the problems of increased expansion or shrinkage, influence of electronic device performance, and high polyimide film , to reduce thermal expansion coefficient, improve thermal dimensional stability and mechanical modulus, and make film formation easier

Inactive Publication Date: 2020-05-29
WUXI CHUANGCAI OPTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the practical application of flexible display and other fields, in addition to high light transmittance, polyimide film has a high thermal expansion coefficient and low modulus, which also leads to the use of flexible display devices such as TFT-LCD and OLED. many problems
For example, under the situation that polyimide film has high transparency but thermal expansion coefficient is high likewise, in thin film transistor (TFT) manufacturing process, this polyimide film is subjected to the change of temperature and will cause remarkable dimensional deformation (expansion or Shrinkage increases), which will lead to damage to the inorganic film in the electronic device, and the performance of the electronic device will be seriously affected

Method used

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  • Transparent polyimide film and preparation method thereof
  • Transparent polyimide film and preparation method thereof
  • Transparent polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] (1) Uniformly disperse 0.095g of small particle size silica (particle size: 10nm) and 0.0094g of large particle size silica (particle size: 30nm) in 0.4176g of N,N-dimethylacetamide, Silica sol was prepared. Add it into a three-necked flask, continue to add 0.125 g of heptafluoropentyltriethoxysilane, start stirring and heat to 100° C. After 2 hours of reaction, stop heating and cool down to room temperature.

[0036] (2) Add 910g of N,N-dimethylacetamide and 96.07g (0.3mol) of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl to the above reaction system, After dissolving, add 133.27g (0.3mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, control the reaction temperature at 0-30°C, and react for 6 hours to prepare a polyamic acid solution. Adjust the solid content of the system to be about 20wt%, and the viscosity at 25°C is 140000cP.

[0037] (3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 20 minutes, then gradu...

Embodiment 2

[0039] (1) 2.00g of small particle size silica (particle size: 5nm) and 0.04g of large particle size silica (particle size: 10nm) were uniformly dispersed in 8.164g of N,N-dimethylacetamide, Silica sol was prepared. Add it into a three-necked flask, continue to add 2.449g of perfluorooctylethyltriethoxysilane, start stirring and heat to 100°C, stop heating after 2 hours of reaction, and cool down to room temperature.

[0040] (2) Add 820g of N,N-dimethylacetamide and 100.27g (0.3mol) of 2,2'-bis(4-aminophenyl)hexafluoropropane to the above reaction system, and add 119.94g after dissolving (0.27mol) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, control the reaction temperature at 0-30°C, and react for 6 hours to prepare a polyamic acid solution. Adjust the solid content of the system to be about 20wt%, and the viscosity at 25°C is 100000cP.

[0041] (3) Coat the polyamic acid solution prepared above on a glass substrate, dry at 180°C for 20 minutes, then graduall...

Embodiment 3

[0043] (1) Evenly disperse 0.618g of small particle size silica (particle size: 10nm) and 0.031g of large particle size silica (particle size: 20nm) in 2.596g of N,N-dimethylacetamide, Silica sol was prepared. Add it into a three-necked flask, continue to add 0.779g of heptafluoropentyltriethoxysilane, start stirring and heat to 100°C, stop heating after 2 hours of reaction, and cool down to room temperature.

[0044] (2) Add 850g of N,N-dimethylacetamide and 155.53g (0.3mol) of 2,2'-bis[4(3-aminophenoxy)phenyl)]hexafluoropropane to the above reaction system After dissolving, add 17.65g (0.06mol) biphenyltetracarboxylic dianhydride, 111.06g (0.25mol) 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, control the reaction temperature at 0 ~30°C, after reacting for 6 hours, a polyamic acid solution was prepared. Adjust the solid content of the system to be about 20wt%, and the viscosity at 25°C is 80000cP.

[0045] (3) Coat the polyamic acid solution prepared above o...

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PUM

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Abstract

The invention relates to a transparent polyimide film and a preparation method thereof. The polyimide film has the characteristics of low expansion, high modulus, high transparency and the like, and is characterized by containing fluorine-containing siloxane grafted modified silicon dioxide particles with different particle sizes. The structural formula of the fluorine-containing siloxane is shownin the specification, and in the formula, X is Cl or any one of methoxyl, ethoxyl and alkyl with 1-10 carbon atoms; and R is a fluorine-containing alkyl group with 1-20 carbon atoms. Due to the factthat the fluorine-containing siloxane grafted modified silicon dioxide particles and the fluorine-containing polyimide matrix resin have good compatibility and dispersity, the prepared polyimide filmis low in thermal expansion coefficient, high in mechanical modulus and excellent in optical light transmittance and can be applied to the fields of flexible display, microelectronics and the like.

Description

technical field [0001] The invention relates to a transparent polyimide film and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] Because of its unique temperature resistance, mechanical properties, insulation properties, solvent resistance, etc., polyimide is widely used in the fields of electronics and microelectronics industries, such as intermediate insulating dielectric layers and shielding protection for large-scale integrated circuits layers etc. However, due to the high density of the aromatic structure of polyimide, the film is usually brown or yellow, has low light transmittance in the visible light region and has a high refractive index, so it cannot be used in the field of optical devices that require high light transmittance. . [0003] In order to reduce the luster of the polyimide film and improve the light transmittance, a large number of studies have focused on the structural improvement of polyimide,...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K9/06C08K3/36C08J5/18
CPCC08J5/18C08J2379/08C08K9/06C08K3/36C08K2201/003C08K2201/014
Inventor 周浪
Owner WUXI CHUANGCAI OPTICAL MATERIALS
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