Preparation method of stainless steel cooling fin integrated capillary module

A stainless steel and heat sink technology is applied in the field of preparation of stainless steel heat sink integrated capillary modules, which can solve the problems of poor heat dissipation performance of stainless steel heat sink, adverse effects on service life, burrs in etching, etc., so as to improve heat dissipation effect and product quality , low production cost, improve the effect of etching

Inactive Publication Date: 2020-05-19
东莞赛诺高德蚀刻科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing technology usually uses pure copper heat sink or stainless steel heat sink for heat dissipation. However, pure copper has low hardness and is easy to deform, which will adversely affect the performance, reliability and service life of the mobile phone; some stainless steel heat sinks have poor heat dissipation performance, Or when it is etched on the stainless steel heat sink, the etching accuracy is not high, there are burrs in the etching, and the process is complicated, and the operation is inconvenient.

Method used

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  • Preparation method of stainless steel cooling fin integrated capillary module
  • Preparation method of stainless steel cooling fin integrated capillary module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for preparing a stainless steel heat sink integrated capillary module, comprising the following steps:

[0022] (1), making the stainless steel substrate into the desired shape, cleaning, degreasing, and polishing after cleaning to obtain a polished stainless steel heat dissipation substrate;

[0023] (2), the stainless steel substrate obtained by step (1) is placed in the first etchant to etch for the first time, and then cleaned;

[0024] (3) Place the stainless steel heat dissipation substrate etched for the first time in the second etching solution for second etching, and after cleaning, obtain a stainless steel heat dissipation fin with internal capillary flow channels.

[0025] Further, in the step (1), the stainless steel substrate is placed in a degreasing liquid for degreasing, and the composition of the degreasing liquid is: sodium bicarbonate 35g / L, sodium dodecylsulfonate 3.5g / L L, polyethylene glycol octyl phenyl ether 4.5g / L.

[0026] Further, i...

Embodiment 2

[0035] A method for preparing a stainless steel heat sink integrated capillary module, comprising the following steps:

[0036] (1), making the stainless steel substrate into the desired shape, cleaning, degreasing, and polishing after cleaning to obtain a polished stainless steel heat dissipation substrate;

[0037] (2), the stainless steel substrate obtained by step (1) is placed in the first etching solution to etch for the first time;

[0038] (3) Place the stainless steel heat dissipation substrate etched for the first time in the second etching solution for second etching, and after cleaning, obtain a stainless steel heat dissipation fin with internal capillary flow channels.

[0039] Further, in the step (1), the stainless steel substrate is placed in a degreasing liquid for degreasing, and the composition of the degreasing liquid is: sodium bicarbonate 32g / L, sodium dodecylsulfonate 3g / L , polyethylene glycol octyl phenyl ether 4g / L.

[0040] Further, in the step (1)...

Embodiment 3

[0048] A method for preparing a stainless steel heat sink integrated capillary module, comprising the following steps:

[0049] (1), making the stainless steel substrate into the desired shape, cleaning, degreasing, and polishing after cleaning to obtain a polished stainless steel heat dissipation substrate;

[0050] (2), the stainless steel substrate obtained by step (1) is placed in the first etching solution to etch for the first time;

[0051] (3) Place the stainless steel heat dissipation substrate etched for the first time in the second etching solution for second etching, and after cleaning, obtain a stainless steel heat dissipation fin with internal capillary flow channels.

[0052] Further, in the step (1), the stainless steel substrate is placed in a degreasing liquid for degreasing, and the composition of the degreasing liquid is: sodium bicarbonate 38g / L, sodium dodecylsulfonate 4g / L , Polyethylene glycol octyl phenyl ether 6g / L.

[0053] Further, in the step (1)...

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Abstract

The invention relates to the technical field of cooling fins, and particularly discloses a preparation method of a stainless steel cooling fin integrated capillary module. The preparation method of the stainless steel cooling fin integrated capillary module comprises the following steps of making a stainless steel substrate into a required shape, cleaning, degreasing, polishing after cleaning, andobtaining a polished stainless steel cooling substrate; placing the stainless steel substrate in first etching liquid, etching for the first time, and then cleaning; and placing the polished stainless steel cooling substrate in second etching liquid, etching for the second time, and cleaning to obtain a stainless steel cooling fin with inner capillary channels. The preparation method is convenient to operate and control, high in etching precision, high in production efficiency, low in production cost, and suitable for large-scale industrial production; and the prepared stainless steel coolingfin is stable in product quality, high in hardness, not easy to deform, capable of forming fine inner capillary channels on the surface, and good in heat dissipation.

Description

technical field [0001] The invention relates to the technical field of heat sinks, and in particular discloses a preparation method of a stainless steel heat sink integrated capillary module. Background technique [0002] At present, microelectronic devices such as smart phones are constantly developing towards ultra-thin and high-performance, and the energy consumption of electronic components inside smart phones is also increasing. Failure to properly handle this heat can degrade the performance, reliability, and lifespan of your phone. Therefore, it is necessary to improve the heat dissipation performance of electronic products such as mobile phones. The existing technology usually uses pure copper heat sink or stainless steel heat sink for heat dissipation. However, pure copper has low hardness and is easy to deform, which will adversely affect the performance, reliability and service life of the mobile phone; some stainless steel heat sinks have poor heat dissipation p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/28H05K7/20
CPCC23F1/28H05K7/2039H05K7/20336
Inventor 王文涛张亮旗王世权
Owner 东莞赛诺高德蚀刻科技有限公司
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