Preparation method of stainless steel cooling fin integrated capillary module
A stainless steel and heat sink technology is applied in the field of preparation of stainless steel heat sink integrated capillary modules, which can solve the problems of poor heat dissipation performance of stainless steel heat sink, adverse effects on service life, burrs in etching, etc., so as to improve heat dissipation effect and product quality , low production cost, improve the effect of etching
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0021] A method for preparing a stainless steel heat sink integrated capillary module, comprising the following steps:
[0022] (1), making the stainless steel substrate into the desired shape, cleaning, degreasing, and polishing after cleaning to obtain a polished stainless steel heat dissipation substrate;
[0023] (2), the stainless steel substrate obtained by step (1) is placed in the first etchant to etch for the first time, and then cleaned;
[0024] (3) Place the stainless steel heat dissipation substrate etched for the first time in the second etching solution for second etching, and after cleaning, obtain a stainless steel heat dissipation fin with internal capillary flow channels.
[0025] Further, in the step (1), the stainless steel substrate is placed in a degreasing liquid for degreasing, and the composition of the degreasing liquid is: sodium bicarbonate 35g / L, sodium dodecylsulfonate 3.5g / L L, polyethylene glycol octyl phenyl ether 4.5g / L.
[0026] Further, i...
Embodiment 2
[0035] A method for preparing a stainless steel heat sink integrated capillary module, comprising the following steps:
[0036] (1), making the stainless steel substrate into the desired shape, cleaning, degreasing, and polishing after cleaning to obtain a polished stainless steel heat dissipation substrate;
[0037] (2), the stainless steel substrate obtained by step (1) is placed in the first etching solution to etch for the first time;
[0038] (3) Place the stainless steel heat dissipation substrate etched for the first time in the second etching solution for second etching, and after cleaning, obtain a stainless steel heat dissipation fin with internal capillary flow channels.
[0039] Further, in the step (1), the stainless steel substrate is placed in a degreasing liquid for degreasing, and the composition of the degreasing liquid is: sodium bicarbonate 32g / L, sodium dodecylsulfonate 3g / L , polyethylene glycol octyl phenyl ether 4g / L.
[0040] Further, in the step (1)...
Embodiment 3
[0048] A method for preparing a stainless steel heat sink integrated capillary module, comprising the following steps:
[0049] (1), making the stainless steel substrate into the desired shape, cleaning, degreasing, and polishing after cleaning to obtain a polished stainless steel heat dissipation substrate;
[0050] (2), the stainless steel substrate obtained by step (1) is placed in the first etching solution to etch for the first time;
[0051] (3) Place the stainless steel heat dissipation substrate etched for the first time in the second etching solution for second etching, and after cleaning, obtain a stainless steel heat dissipation fin with internal capillary flow channels.
[0052] Further, in the step (1), the stainless steel substrate is placed in a degreasing liquid for degreasing, and the composition of the degreasing liquid is: sodium bicarbonate 38g / L, sodium dodecylsulfonate 4g / L , Polyethylene glycol octyl phenyl ether 6g / L.
[0053] Further, in the step (1)...
PUM
Property | Measurement | Unit |
---|---|---|
width | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com