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Shielding film with multilayer metal structure

A multi-layer metal and shielding film technology, applied in the direction of metal layered products, magnetic/electric field shielding, coating, etc., can solve the problem that copper foil and aluminum foil cannot meet the thickness and bending resistance, ordinary shielding film cannot meet the shielding performance requirements, no Use value etc.

Pending Publication Date: 2020-05-15
HAINING ZHUOTAI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper foil and aluminum foil cannot meet the performance requirements of thickness and bending resistance in the specific application of flexible circuit boards, and ordinary shielding films cannot meet the shielding performance requirements of 1 ghz and high frequencies above 65 db. There are copper foils directly used as shielding layers on the market. High-frequency shielding film is used, but the bending resistance and high temperature resistance cannot meet the production needs of flexographic plates, and it also increases the production cost virtually, which has no use value

Method used

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  • Shielding film with multilayer metal structure
  • Shielding film with multilayer metal structure
  • Shielding film with multilayer metal structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] 1) Polyurethane insulating layer formula (according to 100 parts by weight):

[0048] Ren Chi 891 (Guangdong Pusaida Sealing Adhesive Co., Ltd.): 70

[0049] Titanium dioxide: 20

[0050] Auxiliary (Ren Chi 891 curing agent): 5

[0051] Color paste: black: 5

[0052] Ren Chi 891. Titanium dioxide, additives, and black color paste are mixed to obtain black ink;

[0053] 2) Coating black glue on the raw material film: Unwind the prepared release film on the coating line and pass through the coating head, and evenly coat a layer of black glue with a thickness of 3 μm. Solvent touch dry, good volume.

[0054] 3) Vacuum plating of 0.3μm silver layer;

[0055] 4) Apply a conductive adhesive layer with a thickness of 3 μm; the conductive adhesive layer includes epoxy glue, nickel powder, polyurethane curing agent and auxiliary agent with a mass ratio of 70:10:10:10, and is dried and cured;

[0056] 5) Plating a layer of 0.3 μm second metal nickel on the rubber surf...

Embodiment 2

[0060] 1) Formula of epoxy insulating layer (according to 100 parts by weight):

[0061] ZY-3600R (Zhongshan Zhuyi Electronic Materials Co., Ltd.): 70;

[0062] Tysun Universal Oily Black Paste (Dongguan Tysun Pigment Co., Ltd.): 10;

[0063] Titanium dioxide: 10;

[0064] ZY-3600R curing agent: 10;

[0065] Mix ZY-3600R, Tysun universal oily black paste, titanium dioxide and curing agent to get black glue;

[0066] Unwind the prepared release film on the coating line and pass through the coating head, evenly coat a layer of black glue with a thickness of 5 μm, dry the solvent surface in an oven at 100°C to 200°C, and wind up;

[0067] 3) Vacuum coating with 0.5μm copper;

[0068] 4) Apply a conductive adhesive layer with a thickness of 5 μm; the conductive adhesive layer includes epoxy glue, nickel powder, polyurethane curing agent and auxiliary agent with a mass ratio of 70:10:10:10, and is dried and cured;

[0069] 5) Plating a layer of 0.2 μm second metal silver on th...

Embodiment 3

[0074] 1) Formula adjustment of acrylic ink insulating layer (according to 100 parts by weight):

[0075] Petpur adhesive (Chongqing Luchuan): 70

[0076] Titanium dioxide: 10

[0077] petpur curing agent: 10;

[0078] Tysun Universal Oily Black Paste (Dongguan Tysun Pigment Co., Ltd.): 10;

[0079] Mix petpur adhesive, titanium dioxide, petpur glue curing agent and black color paste to obtain black glue;

[0080] 2) Coating black glue on the raw material film: Unwind the prepared release film on the coating line and pass through the coating head, and evenly coat a layer of black glue with a thickness of 7 μm. dry, roll;

[0081] 3) Vacuum plating of 1 μm copper layer;

[0082] 4) Apply a conductive adhesive layer with a thickness of 8 μm; the conductive adhesive layer includes epoxy glue, nickel powder, polyurethane curing agent and auxiliary agent with a mass ratio of 70:10:10:10, and is dried and cured;

[0083] 5) Plating a layer of 0.5 μm second metal copper on the ...

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Abstract

The invention provides a shielding film with a multi-layer metal structure. The shielding film comprises an insulating layer and multiple layers of metal compounded on the insulating layer, the thickness of each layer of metal is 0.05-5 [mu] m,the number of the multiple layers of metal is 2-10, and conductive bonding layers are arranged among the multiple layers of metal. According to the shielding film, the multiple layers of metal are arranged, the thickness of each layer of metal is controlled, and the metal layers are bonded through the conductive bonding layers, so that the shielding filmhas better flexibility and an excellent shielding effect. Besides, by adopting the conductive bonding layer, the bonding force between the metal layers is better. Moreover, the shielding film has very good flexibility while guaranteeing the shielding performance of a high-frequency signal greater than 80db (at) 10ghz; the flexible demands of a flexible circuit board are met, the high temperatureresistance is good, and the binding force of the metal layers can be kept not to be reduced during high-temperature impact, and the shielding film is stable and reliable.

Description

technical field [0001] The invention belongs to the technical field of shielding films, in particular to a shielding film with a multilayer metal structure. Background technique [0002] The existing shielding film materials are copper-aluminum foil tape and the shielding film material with more than 50db within 1ghz. Because of its low price, easy material acquisition and good shielding effect, it has always been the preferred material of various electronics factories. However, copper foil and aluminum foil cannot meet the performance requirements of thickness and bending resistance in the specific application of flexible circuit boards, and ordinary shielding films cannot meet the shielding performance requirements of 1 ghz and high frequencies above 65 db. There are copper foils directly used as shielding layers on the market. High-frequency shielding film is used, but the bending resistance and high temperature resistance cannot meet the production needs of flexo plates,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B32B27/32B32B27/36B32B7/12B32B7/06B32B15/04B32B15/085B32B15/09B32B27/06B32B33/00
CPCH05K9/0088B32B27/32B32B27/36B32B7/12B32B7/06B32B15/043B32B15/085B32B15/09B32B27/06B32B33/00B32B2307/212B32B2307/306B32B2307/558B32B2307/206B32B2255/26H05K9/0084B32B15/095C23C14/14C23C14/24
Inventor 田海玉
Owner HAINING ZHUOTAI ELECTRONICS MATERIALS CO LTD
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