A device for recycling and processing semiconductor materials in waste cpu

Abstract

The invention discloses a semiconductor material recovery and processing device in a waste CPU, which includes a chassis. The chassis is provided with a top cover storage cavity with an opening facing upward. The chassis is provided with a top cover located above the top cover storage cavity. Processing chamber, the processing chamber is connected with the top cover storage chamber, a CPU fixing device is provided in the processing chamber, the CPU fixing device is used to clamp and fix the CPU, and a CPU fixing device is provided in the processing chamber. A top cover removal device on the right side of the fixing device. The processing chamber is provided with a heat dissipation silicone grease removal device located on the upper side of the top cover removal device. The CPU fixation device, the top cover removal device, and the heat dissipation silicone There is a linkage device between the grease removal devices. The invention can remove the top cover and heat dissipation silicone grease on the used CPU, thereby preventing the top cover and heat dissipation silicone grease from being mixed with the broken materials and reducing the difficulty of separation in the later stage.

Description

technical field [0001] The invention relates to the technical field of recycling and processing of waste CPUs, in particular to a device for recycling and processing semiconductor materials in waste CPUs. Background technique [0002] As the computing and control core of the computer system, the central processing unit (CPU) is the final execution unit for information processing and program operation. The desktop CPU is composed of a CPU packaged chip and a top cover. The top cover is mainly used to protect the CPU packaged chip. The top cover and The joints of the CPU packaged chips use heat-dissipating silicone grease or brazing as fillers. Intel uses a large number of heat-dissipating silicone greases as fillers. The semiconductor materials in the CPU packaged chips contain recyclable rare metals, so it can be used for waste CPUs. Recycling of semiconductor materials. At present, the waste CPU recycling process usually adopts direct crushing treatment, so that the top cov...

AI Technical Summary

Problems solved by technology

[0002] As the computing and control core of the computer system, the central processing unit (CPU) is the final execution unit for information processing and program operation. The desktop CPU is composed of a CPU packaged chip and a top cover. The top cover is mainly used to protect the CPU packaged chip. The top cover and The joints of the CPU packaged chips use heat-dissipating silicone grease or brazing as fillers. Intel uses a large number of heat-dissipating silicone greases as fillers. The semiconductor materials in the CPU packaged chips contain recyclable rare metals, so it can be used for waste CPUs. Recycling of semiconductor materials. At present, the waste CPU recycling process usually adopts direct crushing treatment, so that the top cover and heat dissipation silicone grease are mixed in the broken material, which increases the difficulty of later separation. At present, there is a lack of recycling processing equipment that can remove the waste CPU top cover and heat dissipation silicone grease. A kind of equipment that the present invention illustrates can solve the above-mentioned problems

Images