A device for recycling and processing semiconductor materials in waste cpu

Abstract

The invention discloses a semiconductor material recycling device in a waste CPU. The semiconductor material recycling device comprises a case, wherein a top cover storage cavity with an upward opening is formed in the case; a processing cavity positioned on the upper side of the top cover storage cavity is formed in the case; the processing cavity is communicated with the top cover storage cavity; a CPU fixing device is arranged in the processing cavity; the CPU fixing device is used for clamping and fixing the CPU; a top cover detaching device positioned on the right side of the CPU fixing device is arranged in the processing cavity; a heat-dissipating silicone grease removing device positioned on the upper side of the top cover detaching device is arranged in the processing cavity; anda linkage device is arranged between the CPU fixing device and the top cover detaching device and between the CPU fixing device and the heat-dissipating silicone grease removing device. According to the semiconductor material recycling device disclosed by the invention, the top cover and the heat-dissipating silicone grease on the waste CPU can be removed, so that the top cover and the heat-dissipating silicone grease are prevented from being mixed in broken materials, and the later separation difficulty is reduced.

Description

technical field [0001] The invention relates to the technical field of recycling and processing of waste CPUs, in particular to a device for recycling and processing semiconductor materials in waste CPUs. Background technique [0002] As the computing and control core of the computer system, the central processing unit (CPU) is the final execution unit for information processing and program operation. The desktop CPU is composed of a CPU packaged chip and a top cover. The top cover is mainly used to protect the CPU packaged chip. The top cover and The joints of the CPU packaged chips use heat-dissipating silicone grease or brazing as fillers. Intel uses a large number of heat-dissipating silicone greases as fillers. The semiconductor materials in the CPU packaged chips contain recyclable rare metals, so it can be used for waste CPUs. Recycling of semiconductor materials. At present, the waste CPU recycling process usually adopts direct crushing treatment, so that the top cov...

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Problems solved by technology

[0002] As the computing and control core of the computer system, the central processing unit (CPU) is the final execution unit for information processing and program operation. The desktop CPU is composed of a CPU packaged chip and a top cover. The top cover is mainly used to protect the CPU packaged chip. The top cover and The joints of the CPU packaged chips use heat-dissipating silicone grease or brazing as fillers. Intel uses a large number of heat-dissipating silicone greases as fillers. The semiconductor materials in the CPU packaged chips contain recyclable rare metals, so it can be used for waste CPUs. Recycling of semiconductor materials. At present, the waste CPU recycling process usually adopts direct crushing treatment, so that the top cover and heat dissipation silicone grease are mixed in the broken material, which increases the difficulty of later separation. At present, there is a lack of recycling processing equipment that can remove the waste CPU top cover and heat dissipation silicone grease. A kind of equipment that the present invention illustrates can solve the above-mentioned problems

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