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Aging-reinforced titanium-copper alloy and preparation method thereof

A titanium-copper alloy and aging-strengthening technology, applied in the field of copper alloys, can solve the problems of poor weldability and electroplating properties, unsatisfactory effects, and less research on aging precipitation strengthening of titanium-copper

Active Publication Date: 2020-05-05
NINGBO POWERWAY ALLOY MATERIAL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, adding Al, Mg, Si elements, etc. to the titanium-copper alloy, on the one hand, the addition of these elements can precipitate fine and uniform particles in the matrix and improve the strength of the alloy. On the other hand, because the precipitated particles are relatively small, it will not deteriorate significantly. The bending properties of the alloy, but the addition of Mg, Al, etc. to the alloy will have an adverse effect on the hot workability of the alloy and the heat resistance of the coating; when Si is added to the alloy, it is easy to form SiO on the surface 2 Oxide film, resulting in significant deterioration of the weldability and electroplating properties of the material
It can be seen that none of the above improvements have achieved the desired effect, and at present most of them are based on the mechanism of amplitude modulation decomposition strengthening to improve the properties of the alloy through fine-tuning of the composition, and there are few studies on the aging precipitation strengthening of titanium copper

Method used

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  • Aging-reinforced titanium-copper alloy and preparation method thereof
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Embodiment Construction

[0063] The present invention will be further described below in conjunction with the embodiments of the present invention.

[0064] When preparing the copper alloy of the embodiment of the present invention, since Ti, Ni, and P are active metals, a vacuum melting furnace is used for melting and casting. In addition, in order to prevent the test results from being affected by the mixing of impurity elements other than the elements specified in the present invention, raw materials with higher purity are used for smelting.

[0065] For the ingot whose composition is Ti, Ni and P in the content listed in Table 1, and the rest is copper and unavoidable impurities, after heating at 950°C for 3 hours for homogenization and annealing, the processing rate shall not be less than 90%. Carry out hot rolling to obtain a hot-rolled plate with a thickness of no more than 16mm. After surface cutting and peeling, perform the first cold rolling treatment at a processing rate of not less than 90...

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Abstract

The invention relates to an aging-reinforced titanium-copper alloy. The aging-reinforced titanium-copper alloy is characterized by being prepared from the compositions in percentage, by weight, 2.0-4.0% of Ti, 0.5-2.0% of Ni, 0.05-0.5% of P and the balance copper and unavoidable impurities. By controlling the matching ratio of Ni to P to Ti, the yield strength of the aging-reinforced titanium-copper alloy is up to 900-1150 MPa, the conductivity is up to 12-22% IACS, and excellent bending machinability, high-temperature softening resistance and welding properties are obtained. The aging-reinforced titanium-copper alloy is especially applicable to the fields of connectors, terminals, relays and the like.

Description

technical field [0001] The invention relates to the field of copper alloys, in particular to an aging-strengthened titanium-copper alloy. The titanium-copper alloy has good strength, electrical conductivity, bending processability, and high temperature resistance, and has good welding and electroplating properties, and can be used in Connectors, terminals, relays and other fields. Background technique [0002] Titanium-copper alloy has high strength, hardness and excellent stress relaxation resistance. With the development of the information age, its demand is increasing, and it is widely used in terminals and connectors of high-end electronic equipment. At present, due to the continuous development of electronic equipment towards miniaturization and weight reduction, electronic and electrical components such as connectors are also constantly evolving towards miniaturization and weight reduction. However, when the connector is thinned and the spacing is narrowed, the reduct...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22F1/08
CPCC22C9/00C22F1/08
Inventor 刘亚丽杨谏支月鹏唐宁孟祥鹏
Owner NINGBO POWERWAY ALLOY MATERIAL
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