Corrosion etching method of ultra-small quartz wafer

A quartz wafer, ultra-small technology, applied in chemical instruments and methods, single crystal growth, crystal growth, etc., can solve the problems of inability to miniaturize the processing of quartz wafers, reduce cost pressure, avoid investment problems, and optimize impedance performance Effect

Inactive Publication Date: 2020-04-24
NANJING CHINA ELECTRONICS PANDA CRYSTAL TECH CORP
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Problems solved by technology

[0006] The present invention proposes an etching method for ultra-small quartz wafers, the purpose of which is to overcome the above-mentioned defects of the traditional quartz wafer processing technology that the miniaturization of quartz wafers cannot be processed, and at the same time reduce the huge investment and cost pressure of introducing photolithography technology , so as to realize the low-cost and high-efficiency production of ultra-small quartz wafers

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  • Corrosion etching method of ultra-small quartz wafer
  • Corrosion etching method of ultra-small quartz wafer
  • Corrosion etching method of ultra-small quartz wafer

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Embodiment Construction

[0024] The technical solution of the present invention will be further described below according to the embodiments.

[0025] 28MHz ultra-small quartz wafer with a size of 1.387mm×0.992mm is processed. In order to achieve the feasibility of processing, the ultra-small wafer is converted into a large quartz wafer with the same frequency, that is, the size of 12.0mm is processed by traditional wafer processing methods. A 28MHz large quartz wafer with a diameter of 10.6mm.

[0026] Control attached figure 1 , Mesa coating is performed on a clean 12.0mm×10.6mm large quartz wafer to form a 4×4 Mesa area gold-plated array, and the size of a single Mesa area is 0.860mm×0.800mm;

[0027] Control attached figure 2 , put the 12.0mm×10.6mm large quartz wafer after Mesa coating into the hydrogen fluoride etching solution for corrosion etching, and uniformly corrode and thin the large quartz wafer surface except for the coating by 9um.

[0028] Control attached image 3 After Mesa etc...

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Abstract

The invention provides a corrosion etching method for an ultra-small quartz wafer. The corrosion etching method comprises the following steps: 1) processing a large quartz wafer; 2) coating a Mesa region with a film; (3) etching the Mesa region; 4) carrying out size coating; 5) carrying out size corrosion etching; and 6) removing gold from the ultra-small quartz wafer. According to the invention,processing is carried out on a large quartz wafer to indirectly obtain a single quartz wafer; the marginal effect of the low and medium frequency quartz wafer is reduced by using a precision processing technology of Mesa coating and Mesa corrosion etching; the shape processing of an ultra-small-size quartz plate is indirectly completed through size coating and size corrosion etching, so that the problem of huge investment caused by introduction of a photoetching technology is avoided, a subsequent crystal processing coating material can be selected, and the cost pressure is reduced.

Description

technical field [0001] The invention relates to a corrosion etching method for an ultra-small quartz wafer, and belongs to the technical field of production of quartz electronic components. Background technique [0002] With the rapid development of electronic information technology, the miniaturization and integration of electronic components has gradually changed from the trend of theoretical research to reality. As the basic device of electronic systems, the miniaturization design of quartz crystal frequency components is also imperative. , and as the main component of quartz crystal frequency components, the miniaturization design of quartz wafer is imminent. [0003] The traditional quartz wafer shape processing technology is mainly wire-cutting process, using wire-cutting steel wire to cut the sticky quartz crystal rod into slices according to the required angle through physical cutting method, so as to obtain the required shape of the quartz wafer. However, with the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B33/10C30B29/18
CPCC30B29/18C30B33/10
Inventor 姜凡高志祥
Owner NANJING CHINA ELECTRONICS PANDA CRYSTAL TECH CORP
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